Bondwireless Power Module 3D Current Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power module designs for motor drive inverters, such as those using wire bonding for two-dimensional current routing, result in complex layouts, high inductivity, asymmetric current paths, and poor power density due to long routing paths and difficulties in making conductive traces sufficiently wide.
Innovation Solution
A bondwireless power module with three-dimensional current routing, utilizing conductive clips to connect semiconductor dies in a three-dimensional manner over a substrate, eliminating the need for wire bonding and allowing for wider, more symmetrical current paths with lower inductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect dies to conductive traces on a substrate, then the dies can be connected electrically, but the routing paths become long and complex resulting in high inductivity and asymmetric current paths
Solution Approach 1:
The patent transitions from two-dimensional planar routing on a substrate to three-dimensional current routing using stacked layers. Conductive traces are arranged in multiple layers with vertical interconnections, allowing current to flow through multiple dimensions rather than being constrained to a single plane. This dimensional change enables shorter current paths, reduced inductivity, and more symmetric routing while maintaining electrical connection reliability.
2Reliability
If conductive traces are made wider to reduce inductivity, then current paths improve, but the available substrate area is limited making it difficult to achieve sufficient trace width
Solution Approach 1:
By stacking conductive traces in multiple layers vertically, the patent effectively increases the available cross-sectional area for current flow without requiring additional substrate area. The multi-layer structure allows wider equivalent trace widths through vertical stacking, reducing inductivity while maintaining a compact footprint.
Solution Approach 2:
The patent embeds multiple conductive trace layers within a compact substrate structure, with each layer nested vertically above or below others. This nesting approach allows multiple current paths to occupy overlapping horizontal spaces at different vertical levels, effectively multiplying the current-carrying capacity within the same footprint.
3Adaptability or versatility
If long routing paths are used to connect multiple dies, then all dies can be interconnected, but the inductivity increases and power density decreases
Solution Approach 1:
The multi-layer structure enables current to transition between layers via vertical interconnections, creating three-dimensional current paths that are significantly shorter than planar routes. This allows efficient interconnection of multiple dies with reduced inductivity by routing current through stacked layers rather than long horizontal paths.
4Area of stationary object
If the power module footprint is reduced to improve power density, then space efficiency improves, but the routing paths become even more constrained making it harder to achieve low inductivity
Solution Approach 1:
The patent resolves the contradiction by utilizing vertical space through multiple stacked layers. This allows the module footprint to be minimized while maintaining adequate current path dimensions through the vertical dimension. The three-dimensional routing provides sufficient trace width and path length control without increasing the horizontal footprint.
Data Source
AI summary
According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.