Bone-Conducting Earphone Locating Gaps for Adhesive Fixation

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Solution Overview

Problem

Existing earphone shell assemblies are not easily secured with adhesive, making assembly challenging.

Innovation Solution

The earphone design includes a shell assembly with an accommodation cavity for a bone-conducting loudspeaker, featuring locating portions to maintain a predetermined gap for adhesive application, ensuring secure fixation and even distribution of the fixing adhesive, and incorporating a vibration transmission sheet with central and annular fixing portions and linkage assemblies for enhanced stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional adhesive application methods are used on shell assemblies, then the adhesive can be applied, but the assembly is not easily secured and assembly becomes challenging

Engineering Contradiction:
Improveease of assemblyVSAvoidfixing reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The locating portions are pre-formed on the shell assembly or bone-conducting loudspeaker before adhesive application. These locating portions create a predetermined gap that guides and contains the adhesive, ensuring proper positioning and distribution before the actual bonding occurs. This preliminary structural preparation simplifies the assembly process while ensuring reliable fixation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The locating portions act as an intermediary structure between the shell assembly and the bone-conducting loudspeaker. They maintain a controlled gap that facilitates adhesive application and distribution, mediating the bonding process between the two components. This intermediary structure ensures the adhesive is evenly distributed and properly positioned, improving both assembly ease and fixing reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If adhesive is applied without locating portions, then the application process may be simpler, but the adhesive distribution is uneven and fixing effect is reduced

Engineering Contradiction:
Improveadhesive distribution uniformityVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The locating portions divide the bonding interface into specific regions, creating a segmented structure with predetermined gaps. This segmentation guides the adhesive to specific areas, ensuring even distribution across the bonding surface. The locating portions are distributed around the periphery, creating multiple adhesive application zones that improve overall bonding uniformity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The locating portions create localized gaps at specific positions around the periphery of the bone-conducting loudspeaker. This local quality approach ensures that adhesive is applied precisely where needed, with controlled gap sizes at specific locations. The peripheral positioning of locating portions creates optimal adhesive distribution zones without requiring complex overall structural changes.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250267391A1earphones
Publication Date: 2025.08.21 SHENZHEN SHOKZ CO LTD
  • US20250267391A1 patent drawing
  • US20250267391A1 patent drawing
  • US20250267391A1 patent drawing

AI summary

The present disclosure relates an earphone, comprising a shell assembly, a bone-conducting loudspeaker, and a fixing adhesive. The shell assembly is provided with an accommodation cavity. The bone-conducting loudspeaker is accommodated in the accommodation cavity. The bone-conducting loudspeaker is configured to vibrate along a central axis direction of the bone-conducting loudspeaker. The shell assembly and/or the bone-conducting loudspeaker is provided with a locating portion. The locating portion is configured to maintain a predetermined gap between an inner peripheral surface of the shell assembly and an outer peripheral surface of the bone-conducting loudspeaker along a radial direction of the bone-conducting loudspeaker. The fixing adhesive is filled in the predetermined gap and configured to connect the shell assembly to the bone-conducting loudspeaker. The present disclosure facilitates the adhesive fixation of the internal parts of the earphone and reduces the difficulty of assembling the earphone.