Bone-Conduction MEMS Chip With Integrated Mass Block Sensitivity Tuning
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Solution Overview
Problem
Existing bone-conduction packaging structures are large, complex, costly, and difficult to adjust sensitivity.
Innovation Solution
A bone-conduction MEMS chip with a diaphragm featuring a mass block on its surface, allowing flexible adjustment of sensitivity by varying the mass block's size, and a manufacturing method involving etching processes to integrate the mass block directly onto the diaphragm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate vibration assembly with mass block is used in bone-conduction packaging structure, then the device can achieve bone-conduction function, but the device becomes large, complex, and costly
Solution Approach 1:
The patent merges the mass block with the diaphragm by directly forming the mass block on the diaphragm surface during the MEMS chip manufacturing process. This integration eliminates the need for separate vibration assembly components (vibration plate, frame, separate mass block), thereby reducing device complexity while maintaining bone-conduction functionality. The mass block and diaphragm become a single integrated structure that performs both functions simultaneously.
Solution Approach 2:
The integrated mass block-diaphragm structure serves multiple functions: the diaphragm acts as both the vibration sensing element and the mass block serves as both the vibration mass and sensitivity adjustment element. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure while maintaining reliable bone-conduction performance.
2Reliability
If a separate vibration assembly with mass block is used in bone-conduction packaging structure, then the device can achieve bone-conduction function, but the device becomes costly
Solution Approach 1:
By combining the mass block and diaphragm into a single integrated structure formed during the MEMS chip manufacturing process, the patent eliminates the need for separate vibration assembly components. This integration reduces manufacturing steps, material costs, and assembly operations, thereby lowering the overall device cost while maintaining bone-conduction functionality.
Solution Approach 2:
The mass block is pre-formed on the diaphragm during the MEMS chip manufacturing process rather than being added separately later. This preliminary integration of the mass block with the diaphragm eliminates subsequent assembly steps and reduces overall manufacturing complexity, leading to lower production costs.
3Reliability
If traditional bone-conduction packaging structure is used, then the device can achieve bone-conduction function, but sensitivity adjustment is difficult
Solution Approach 1:
The patent enables dynamic sensitivity adjustment by allowing the mass block size to be varied during the MEMS chip manufacturing process. Since the mass block is integrated with the diaphragm, its dimensions can be precisely controlled and adjusted to achieve different sensitivity levels. This dynamic adjustability is accomplished through standard semiconductor fabrication techniques, allowing flexibility in sensitivity tuning without requiring separate adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller, less costly, and simpler structure with adjustable sensitivity, reducing the need for separate vibrating sheets and mass blocks.
Implementation Method 1
a bone-conduction Micro-Electro-Mechanical System (MEMS) chip with high sensitivity
Implementation Method 2
This excitation causes the vibration plate and mass block to vibrate, generating vibrations in the gas within the accommodating space
Data Source
AI summary
The present application provides a bone-conduction MEMS chip and a manufacturing method thereof, and a bone-conduction packaging structure having the bone-conduction MEMS chip. The bone-conduction MEMS chip includes a substrate having a cavity, a diaphragm supported on the substrate, and a back plate spaced apart on a side of the diaphragm away from the substrate. A side of the diaphragm away from the back plate is provided with a mass block. The mass block in the bone-conduction MEMS chip of the present application is formed directly on the diaphragm, and the bone-conduction packaging structure avoids setting the vibration sheet and the mass block additionally, resulting in lower costs, simpler packaging, and a smaller structure.