Bone Conduction Receiver Snap-Fit Encapsulation
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Solution Overview
Problem
Conventional bone conduction receivers face issues with poor sealing and stability due to the riveting and crimping process, leading to excessive distortion, inconsistent frequency response, and low assembly efficiency.
Innovation Solution
The design eliminates the need for riveting and crimping by using a protective cover that encapsulates the components, improving assembly efficiency and product yield while maintaining stable frequency response and high bandwidth consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If riveting and crimping are used for encapsulation, then the housing opening is sealed, but the assembly efficiency is low and product yield is difficult to guarantee
Solution Approach 1:
The patent removes the riveting and crimping processes from the encapsulation method. Instead of using these complex mechanical fastening methods, the patent uses a simple snap-fit structure where the circuit board directly engages with the housing through elastic deformation of the housing material, eliminating the need for additional riveting or crimping steps and significantly improving assembly efficiency.
Solution Approach 2:
The patent replaces the mechanical riveting and crimping systems with an elastic deformation mechanism. The housing is designed with elastic portions that deform during assembly to create a snap-fit connection, substituting complex mechanical fastening systems with a simpler elastic mechanical principle that maintains sealing quality while improving assembly efficiency.
2Reliability
If riveting is used for encapsulation, then the housing is sealed, but the adjacent sides are compressed and lead to poor sealing
Solution Approach 1:
The patent removes the riveting process that causes compression of adjacent sides. By using a snap-fit structure with elastic portions, the design eliminates the compression-induced deformation that leads to poor sealing, allowing the housing sides to maintain their original geometry and achieve better sealing quality.
Solution Approach 2:
The patent changes the mechanical parameters of the housing by introducing elastic portions with specific deformation characteristics. These elastic portions are designed to deform within a controlled range during assembly, creating the snap-fit connection without causing excessive compression to the adjacent sides, thus maintaining manufacturing precision and sealing quality.
3Reliability
If riveting and crimping are used for encapsulation, then the housing opening is sealed, but the distortion is excessive and frequency response is unstable
Solution Approach 1:
The patent removes the riveting and crimping processes that cause distortion of the housing structure. By using a snap-fit encapsulation method, the design eliminates the excessive distortion that affects the positioning of internal components, thereby maintaining stable frequency response characteristics.
Solution Approach 2:
The patent changes the encapsulation method from high-force mechanical fastening to a controlled elastic deformation process. This parameter change in the assembly method reduces the distortion applied to the housing and internal components, ensuring stable frequency response while achieving proper encapsulation sealing.
4Reliability
If riveting and crimping are used for encapsulation, then the housing is sealed, but the assembly process is complex and product yield is low
Solution Approach 1:
The patent removes the complex riveting and crimping processes from the assembly steps. By using a simple snap-fit structure where the circuit board directly engages with the housing, the design significantly simplifies the assembly process, making it easier to manufacture while maintaining reliable encapsulation sealing.
Solution Approach 2:
The patent replaces the complex mechanical riveting and crimping systems with a simpler elastic snap-fit mechanism. This substitution reduces the complexity of the assembly process, requiring fewer tools and steps, thereby improving ease of manufacture and increasing product yield while maintaining sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the assembly efficiency and product yield, reduces distortion, stabilizes frequency response, and ensures high consistency in bandwidth extension, applicable to bone conduction receivers of various shapes.
Implementation Method 1
Another end of the coil extends into the bracket and surrounds the magnetic loop assembly
Implementation Method 2
The bone conduction receiver enables the user to hear the sound through the principle of bone conduction
Data Source
AI summary
A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.