Bone Conduction Microphone Layer Structure for Noise Vibration Damping
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Solution Overview
Problem
In high-noise environments, bone conduction microphones struggle to effectively capture user voice signals due to interference from external noise vibrations, which significantly affects the signal-to-noise ratio.
Innovation Solution
The bone conduction microphone incorporates a noise reduction component with at least two dielectric layers made of elastic materials. These layers are designed to absorb external noise vibrations, with a rough contact surface adding air spacing and increasing energy loss between layers, thereby reducing noise impact on the sound pickup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a bone conduction microphone is used to capture vibration signals in high-noise scenarios, then the signal-to-noise ratio of the wanted signal is improved, but external noise is propagated to the microphone in the form of vibration which affects use effect
Solution Approach 1:
The patent divides the microphone structure into multiple functional layers including a sound pickup unit, a vibration obtaining component, and a noise reduction component with multiple dielectric layers. This segmentation allows different parts to handle different aspects of signal capture and noise reduction independently, resolving the contradiction between capturing weak signals and rejecting noise vibrations.
Solution Approach 2:
The patent introduces dielectric layers as intermediary elements between the sound pickup and the external environment. These dielectric layers act as mediators that selectively transmit desired sound vibrations while blocking harmful external noise vibrations, thus resolving the contradiction between signal capture and noise rejection.
2Object-affected harmful factors
If dielectric layers are added to reduce noise vibration, then noise reduction effect is achieved, but device complexity increases
Solution Approach 1:
The patent uses thin dielectric layers instead of bulky noise reduction structures. These thin film-like dielectric layers provide effective noise reduction while maintaining a compact and simple overall device structure, thus resolving the contradiction between noise reduction performance and device complexity.
Solution Approach 2:
The patent employs composite structures combining different materials with complementary properties - the dielectric layers are made of materials that provide both mechanical support and noise reduction functionality. This composite approach achieves effective noise reduction without requiring additional complex components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of dielectric layers effectively reduces external noise interference, improving the signal-to-noise ratio and enhancing the overall performance of the bone conduction microphone in high-noise environments.
Implementation Method 1
The at least two dielectric layers include a first dielectric layer and a second dielectric layer. Both the first dielectric layer and the second dielectric layer are made of elastic materials.
Implementation Method 2
the noise reduction component is configured to absorb vibration in another direction other than the sound pickup surface
Implementation Method 3
A surface that is of the first dielectric layer and that is in contact with the second dielectric layer is a rough surface, or a surface that is of the second dielectric layer and that is in contact with the first dielectric layer is a rough surface. That is, there are some gaps between the second dielectric layer and the first dielectric layer.
Data Source
AI summary
Embodiments of this application disclose a bone conduction microphone, a headphone, and a call apparatus. The bone conduction microphone includes a sound pickup, a vibration obtaining component, and a noise reduction component. The noise reduction component includes a first dielectric layer and a second dielectric layer that are stacked. The first dielectric layer and the second dielectric layer are made of elastic materials, and cover another surface of the sound pickup other than a sound pickup surface, and an opening is disposed at one end corresponding to the sound pickup surface. The vibration obtaining component includes a third dielectric layer. The third dielectric layer is disposed at a layer of the sound pickup close to the sound pickup surface, and seals the opening end of the first dielectric layer. A contact surface between the first dielectric layer and the second dielectric layer is a rough contact surface.