Boost Chopper Circuit Asymmetric Semiconductor Packages
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Solution Overview
Problem
Conventional boost chopper circuits require replacement of both the switching device and backflow prevention diode even if only one component fails, leading to unnecessary replacement costs and reduced productivity due to the inability to distinguish between failing and non-failing components.
Innovation Solution
A boost chopper circuit design where the switching device circuit and backflow prevention diode circuit are housed in separate semiconductor packages with distinct mounting features and shapes, allowing for individual replacement of failed components and preventing mixing during manufacturing and maintenance, while utilizing wide band gap semiconductors to reduce power losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the switching device and backflow prevention diode are housed in the same package, then the device structure is simplified and manufacturing is easier, but the entire package must be replaced even when only one component fails, leading to increased replacement costs and reduced productivity
Solution Approach 1:
The patent divides the semiconductor components into separate packages: the switching device is housed in a first semiconductor package while the backflow prevention diode is housed in a second semiconductor package. This segmentation allows individual replacement of failed components without replacing the entire assembly, thereby improving productivity and reducing replacement costs while maintaining ease of manufacture through standardized separate packages
2Device complexity
If the switching device and backflow prevention diode are housed in the same package, then the device structure is simplified, but it becomes impossible to distinguish between failing and non-failing components, leading to unnecessary replacement
Solution Approach 1:
By housing the switching device and backflow prevention diode in separate semiconductor packages with distinct mounting portions, the patent enables easy identification and selective replacement of failed components. The physical separation makes it immediately apparent which component needs replacement, simplifying repair operations without significantly increasing overall device complexity
Solution Approach 2:
The patent employs asymmetric design by making the first and second semiconductor packages have different shapes and mounting portion configurations. This asymmetry ensures that the packages cannot be mistakenly interchanged during replacement operations, providing clear visual and physical differentiation between the two components for easier repair identification
3Productivity
If separate semiconductor packages are used for the switching device and backflow prevention diode, then selective replacement of failed components is enabled, but the device structure becomes more complex
Solution Approach 1:
The patent implements segmentation by using separate semiconductor packages for the switching device and backflow prevention diode, connected through a reactor. This allows independent replacement of failed components, improving productivity by eliminating unnecessary replacements while the modular structure keeps the overall device complexity manageable through standardized interfaces and connections
4Ease of manufacture
If the first and second semiconductor packages have the same shape and mounting portions, then manufacturing is simpler, but mixing up of packages can occur during replacement and manufacturing
Solution Approach 1:
The patent applies asymmetry by designing the first semiconductor package and second semiconductor package with different shapes and different mounting portion configurations. This asymmetric design prevents mixing up of packages during replacement and manufacturing operations, as each package has a unique form factor that corresponds to its specific mounting location, thereby ensuring operational reliability without significantly complicating the manufacturing process
Data Source
AI summary
In a boost chopper circuit, a distance between a plurality of first mounting portions of a first semiconductor package that houses a switching device circuit and a distance between a plurality of second mounting portions of a second semiconductor package that houses a backflow prevention diode circuit are different from each other.