Boost Circuit Substrate Layout for Creepage Discharge Isolation
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Solution Overview
Problem
Existing voltage generation devices face issues with insufficient dielectric strength along the creepage direction due to creeping discharges on substrate surfaces and interfaces, leading to potential partial discharges and ozone generation, which can cause short-circuit faults, while attempts to increase dielectric strength through larger components result in circuit size enlargement.
Innovation Solution
The boost circuit is designed with insulated substrates divided into multiple units, and components such as capacitors and diodes are disposed across insulation layers between these units, enhancing dielectric strength along the creepage direction without increasing the circuit size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrode spacing is increased to prevent creeping discharge, then the dielectric strength is improved, but the circuit size increases
Solution Approach 1:
The invention transitions from increasing spacing in the planar direction to utilizing the vertical dimension by stacking multiple insulated substrates. The creepage path is extended through the thickness direction of stacked substrates, allowing sufficient dielectric strength without increasing the footprint area of the circuit.
Solution Approach 2:
The circuit is divided into multiple insulated substrate units stacked vertically. Each substrate contains partial circuit components, and the stacking creates multiple insulation layers that collectively provide the required creepage distance. This segmentation allows the creepage path to be distributed across multiple layers rather than requiring large spacing on a single plane.
2Reliability
If larger-size components are used to increase electrode spacing, then creeping discharge is prevented, but the circuit size increases
Solution Approach 1:
Instead of increasing component size or spacing in the horizontal plane, the invention utilizes the vertical dimension through substrate stacking. The creepage path is extended through multiple insulation layers in the thickness direction, allowing standard-sized components to be used while still achieving sufficient dielectric strength.
Solution Approach 2:
Different regions of the circuit are arranged on different stacked substrates, creating local insulation zones. The insulation property is enhanced locally at each interface between substrates, and the cumulative effect of multiple interfaces provides the required overall dielectric strength without requiring all components to be larger size.
3Reliability
If a slit is provided between electrodes to prevent discharge, then the electric field intensity is controlled, but the slit end portions have insufficient air layer width causing partial discharge
Solution Approach 1:
The insulation strategy shifts from relying on horizontal air gaps (slits) to utilizing vertical insulation layers through substrate stacking. The creepage path is extended through the thickness direction of multiple substrates, providing sufficient insulation without creating the problematic geometry of narrow slit end portions that concentrate electric fields.
Solution Approach 2:
Multiple insulated substrates act as intermediary layers between high-voltage and low-voltage regions. These substrate layers with their insulation coatings serve as mediators that distribute and reduce the electric field intensity gradually across multiple interfaces, preventing both creeping discharge and partial discharge phenomena.
Data Source
AI summary
A boost circuit that boosts a voltage using multiple capacitors and multiple diodes disposed on an insulated substrate, where the insulated substrate is divided into multiple insulated substrates, and at least one of the multiple capacitors or the multiple diodes is disposed between the insulated substrates to cross an insulation layer between the insulated substrates.