DC-DC Boost Circuit Gate Drive for Lower MOSFET Heat

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Solution Overview

Problem

DC-DC boost circuits in high-brightness liquid crystal displays and micro-light-emitting diode displays face issues with excessive temperature due to the use of small package MOSFETs without heat sinks, leading to high power consumption and heat generation.

Innovation Solution

A DC-DC boost circuit with a control module that provides a control signal with a high-level voltage of 0.5 to 0.8 times the maximum rated gate-source voltage of the power MOSFET, along with a sink current not less than 0.5A, to reduce power consumption and heat generation by increasing the gate-source voltage during turn-on and providing a large sink current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If small package power MOSFETs without heat sinks are used, then the size and cost of the DC-DC boost circuit are reduced, but the temperature of the MOSFET becomes excessive

Engineering Contradiction:
Improvesize of DC-DC boost circuitVSAvoidtemperature of power MOSFET
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent changes the voltage parameter of the control signal to reduce MOSFET temperature. Specifically, it sets the high-level voltage to 0.5-0.8 times the maximum rated gate-source voltage, and ensures the sink current capability is at least 0.5A. This parameter optimization reduces conduction losses and turn-on losses, thereby reducing heat generation and MOSFET temperature without requiring larger packages or heat sinks.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If small package power MOSFETs without heat sinks are used, then the cost of the DC-DC boost circuit is reduced, but the temperature of the MOSFET becomes excessive

Engineering Contradiction:
Improvecost of DC-DC boost circuitVSAvoidtemperature of power MOSFET
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent optimizes control signal parameters (voltage set to 0.5-0.8 times maximum rated gate-source voltage, sink current capability of at least 0.5A) to reduce MOSFET temperature. This allows the use of cost-effective small package MOSFETs without heat sinks while maintaining acceptable operating temperatures through improved electrical parameter control rather than requiring expensive thermal management solutions.

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If the high-level voltage of the control signal is increased to reduce conduction losses, then the power consumption is reduced, but the risk of exceeding the maximum rated gate-source voltage increases

Engineering Contradiction:
Improveconduction loss of power MOSFETVSAvoidrisk of exceeding maximum rated gate-source voltage
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent identifies the optimal voltage range as 0.5-0.8 times the maximum rated gate-source voltage. This parameter setting achieves a balance: it provides sufficiently high gate voltage to reduce conduction losses and improve MOSFET on-state performance, while maintaining a safety margin below the maximum rated voltage to prevent reliability issues. The sink current capability of at least 0.5A further ensures proper gate charging.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250364894A1DC-DC boost circuit and driving circuit board
Publication Date: 2025.11.27 BEIJING BOE DISPLAY TECH CO LTD
  • US20250364894A1 patent drawing
  • US20250364894A1 patent drawing
  • US20250364894A1 patent drawing

AI summary

The present disclosure belongs to the technical field of display. Provided are a DC-DC boost circuit and a driving circuit board. The DC-DC boost circuit includes a power MOSFET, and a control circuit electrically connected to a control terminal of the power MOSFET and configured to provide a control signal capable of controlling turn-on and turn-off of the power MOSFET. A voltage value of a high-level signal in the control signal is 0.5 to 0.8 times a maximum rated value of a gate-source voltage of the power MOSFET.