Boost Spring Holder for Thermal Contact in High Power Density Electronics
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices face challenges in maintaining effective thermal contact and efficiently dissipating heat in compact systems with high power densities, leading to increased operating temperatures.
Innovation Solution
A thermally-conductive retaining device with coil springs and a heatsink assembly that applies compressive force to maintain thermal contact between heat-generating components and a cold plate, utilizing a thermally-conductive and electrically-insulating adhesive layer to enhance heat transfer, and incorporating a fluid circulation system for active cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power density is increased to miniaturize the system, then system size is reduced, but operating temperature increases and thermal contact maintenance becomes more difficult
Solution Approach 1:
The patent applies different material properties to different parts of the mounting structure: thermally-conductive materials (metal brackets, thermal paste, thermal pads) are used in regions requiring heat transfer, while electrically-insulating materials are used where electrical isolation is needed. This local differentiation allows efficient heat dissipation from the high-power-density components without compromising electrical safety.
Solution Approach 2:
The mounting structure employs composite material solutions, particularly the combination of metal brackets with thermally-conductive adhesive or thermal pads. This composite approach creates a multi-functional interface that simultaneously provides mechanical mounting, thermal conduction, and electrical insulation, enabling effective heat management in compact high-power-density systems.
2Volume of moving object
If compact mounting structures are used to reduce space, then system miniaturization is achieved, but maintaining good thermal contact becomes challenging
Solution Approach 1:
The patent incorporates preliminary thermal interface preparation through pre-applied thermally-conductive adhesive or pre-positioned thermal pads on the mounting structure before component attachment. This preliminary action ensures optimal thermal contact is established from the outset, compensating for the challenges of compact mounting and preventing thermal contact degradation during operation.
Solution Approach 2:
The patent introduces thermally-conductive adhesive or thermal pads as intermediary materials between the mounting structure and power-dissipating components. These intermediaries fill microscopic gaps and surface irregularities, ensuring reliable thermal contact even in compact configurations where direct metal-to-metal contact would be difficult to achieve and maintain.
3Temperature
If dedicated heat dissipation devices are incorporated to manage high power density, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the mounting structure itself: the same metal bracket or housing that provides mechanical support and component positioning also serves as a heat dissipation device through its thermally-conductive properties. This integration eliminates the need for separate, dedicated heat dissipation components, thereby managing high power density without increasing overall device complexity.
Solution Approach 2:
The mounting structure is designed with multi-functionality, serving simultaneously as a mechanical mount, an electrical insulator, and a thermal conduction path. This universal design allows a single component to fulfill multiple roles, providing effective heat dissipation for high-power-density applications while avoiding the complexity increase that would result from adding separate dedicated heat dissipation devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from electronic components by maintaining consistent thermal contact and utilizing active cooling, reducing operating temperatures and enabling miniaturization of electronic systems while managing high power densities.
Implementation Method 1
a spring including a first end portion opposite a second end portion... biased in compression between the retaining device and the electronic component
Implementation Method 2
utilizing a thermally-conductive and electrically-insulating adhesive layer to enhance heat transfer
Implementation Method 3
incorporating a fluid circulation system for active cooling
Data Source
AI summary
A system and method of dissipating heat form electronic components in an electronic device is disclosed. The apparatus includes a retaining device having a cavity extending upwardly a predetermined distance from a lower surface of the casing. A spring is seated within the cavity such that a lower portion of the spring protrudes outwardly a predetermined distance from the lower surface of the casing. A heatsink is positioned below a heat generating component such that the spring of the retaining device forces the heat generating component against the heatsink.