Booster Antenna Design for Smart Card Coupling Efficiency
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Solution Overview
Problem
Current smart card technologies face challenges in enhancing coupling efficiency between the antenna module and the external RFID reader, particularly in the design of the booster antenna and wire embedding processes, which affect the performance of contactless smart cards.
Innovation Solution
The proposed solution involves improving the booster antenna design by incorporating a card antenna, coupler coil, and extension antenna components, with configurations such as multiple windings, off-center coupler coils, and varying wire thickness and resistance, along with advanced embedding techniques using ultrasonic tools to control force and power during wire embedding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of turns in the booster antenna is increased to improve coupling efficiency, then the inductive coupling is enhanced, but the card's stiffness is compromised
Solution Approach 1:
The patent applies local quality by varying wire thickness and resistance in different sections of the booster antenna. Thinner wires with higher resistance are used in specific areas to increase the number of turns and improve coupling efficiency, while thicker wires are used in other areas to maintain card stiffness and structural integrity.
Solution Approach 2:
The patent changes physical parameters of the antenna wire, specifically varying the wire diameter and resistance along different sections of the booster antenna. This allows optimization of the antenna's inductive coupling properties without uniformly compromising the card's mechanical strength.
2Manufacturing precision
If advanced embedding techniques with controlled force and power are used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical embedding methods with ultrasonic vibration technology. The ultrasonic embedding tool uses high-frequency vibrations to embed the wire into the substrate with precise control over force and power, achieving superior manufacturing precision while reducing the complexity of mechanical force control systems.
Solution Approach 2:
The patent utilizes ultrasonic vibration in the embedding tool to achieve precise wire embedding. The vibrational energy allows for controlled insertion of the wire into the substrate with exact force and power parameters, improving manufacturing precision through a well-understood physical phenomenon.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the inductive coupling and reduces the resonance frequency of the booster antenna, improving the overall performance and manufacturability of smart cards by increasing the number of turns in a given space without compromising the card's stiffness.
Implementation Method 1
imparting an ultrasonic vibration to the embedding tool
Implementation Method 2
enhances the inductive coupling
Data Source
AI summary
A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).