Booster Antenna Configurations for Smart Card Coupling
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Solution Overview
Problem
Current smart card technologies face challenges in enhancing coupling efficiency between the antenna module and the external reader, particularly in contactless modes, due to limitations in the design and configuration of booster antennas and the embedding process of wires in the card body substrate.
Innovation Solution
The proposed solution involves improving the booster antenna configuration by incorporating a card antenna, coupler coil, and extension antenna components, with arrangements such as multiple windings, varying pitches, and different thicknesses, along with embedding techniques using ultrasonic tools to control force and power during wire embedding, allowing for enhanced inductive coupling and improved wire embedding consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional booster antenna configurations are used, then the device complexity is low, but the coupling efficiency between antenna module and external reader is insufficient
Solution Approach 1:
The booster antenna is divided into multiple windings (first winding, second winding, third winding) with different configurations. Each winding serves specific coupling functions, allowing optimization of electromagnetic field distribution and coupling efficiency with the antenna module and external reader separately.
Solution Approach 2:
Different windings have different pitch values (first pitch, second pitch, third pitch) and are positioned at different locations. The first winding has a first pitch optimized for coupling with the antenna module, while the second and third windings have different pitches optimized for coupling with the external reader, creating local optimization of coupling quality.
2Manufacturing precision
If wire embedding is performed without controlled force and power, then the manufacturing process is simple, but the wire embedding consistency and antenna performance are poor
Solution Approach 1:
The ultrasonic wire embedding process incorporates force control and power control mechanisms that provide feedback during embedding. The system monitors and adjusts the ultrasonic vibration parameters and applied force to maintain consistent embedding depth and quality across different wires and production batches.
Solution Approach 2:
The embedding process controls specific parameters including ultrasonic vibration frequency, vibration amplitude, and applied force. By precisely controlling these parameters, the process achieves consistent wire embedding quality while maintaining manufacturability through standardized process conditions.
3Reliability
If multiple antenna components with varying pitches and thicknesses are used, then the inductive coupling is enhanced, but the device complexity increases
Solution Approach 1:
The antenna system uses multiple windings with different pitch values to dynamically adapt to different coupling requirements. The varying pitches allow the antenna to optimize its electromagnetic characteristics for different operating conditions and coupling distances, enhancing inductive coupling strength.
Solution Approach 2:
The booster antenna combines multiple conductive winding structures with different geometric properties (pitch, thickness, position) into a composite antenna system. This composite structure leverages the complementary characteristics of each winding to achieve superior overall coupling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the inductive coupling between the antenna module and the external reader, improving communication integrity and reducing the resonance frequency, thereby increasing the performance and manufacturability of smart cards.
Implementation Method 1
embedding techniques using ultrasonic tools to control force and power during wire embedding
Implementation Method 2
improving the booster antenna configuration by incorporating a card antenna, coupler coil, and extension antenna components, with arrangements such as multiple windings, varying pitches, and different thicknesses, along with embedding techniques using ultrasonic tools to control force and power during wire embedding, allowing for enhanced inductive coupling
Data Source
AI summary
A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) component contributing to the inductance of the booster antenna (BA). At least one of the components may have a pitch which is different than one or more of the other components. A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).