Integrated Bootstrap Circuit Using On-Chip Trench Capacitors
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Solution Overview
Problem
Conventional power conversion systems require separate discrete diodes and capacitors for the bootstrap circuit, occupying significant board area and complicating the integration process.
Innovation Solution
Integration of diodes and capacitors within the same silicon as part of the IC package, utilizing various types of planar and trench capacitors and diodes to reduce board space and enhance integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate discrete diodes and capacitors are used for the bootstrap circuit, then the circuit functionality is achieved, but the board area occupied increases and integration complexity increases
Solution Approach 1:
The patent integrates the bootstrap capacitor and diode directly into the IC package, merging previously separate discrete components into a unified integrated structure. This consolidation eliminates the need for separate board-mounted components, directly reducing board area while simplifying the integration process through unified manufacturing.
Solution Approach 2:
The IC package is designed to perform multiple functions: it contains the power converter circuitry, the bootstrap capacitor, and the bootstrap diode all within a single universal package. This multi-functionality allows the same package to serve both as the power conversion core and as the bootstrap circuit implementation, eliminating the need for dedicated separate components.
2Quantity of substance
If separate discrete diodes and capacitors are used for the bootstrap circuit, then the circuit functionality is achieved, but the number of components increases
Solution Approach 1:
The patent merges the bootstrap capacitor and diode into the IC package, reducing the total component count from multiple discrete parts to an integrated unity. This consolidation directly addresses the issue of excessive component quantity while simultaneously simplifying the integration process through unified manufacturing procedures.
3Area of stationary object
If integrated capacitor and diode are used within the IC package, then board space is reduced and integration is simplified, but manufacturing complexity may increase
Solution Approach 1:
The patent employs different capacitor implementations (planar vs. trench) and diode implementations (planar vs. trench) that can be selectively manufactured using standard semiconductor fabrication processes. This segmentation of manufacturing approaches allows choice of the most suitable technique based on specific design requirements, maintaining ease of manufacture while achieving integration benefits.
Data Source
AI summary
Semiconductor devices and integrated circuits implementing power converters are described. An integrated circuit integrated circuit can include a power stage, a driver and a bootstrap circuit. The driver can be configured to drive the power stage. The bootstrap circuit can be configured to drive a high-side switch in the power stage in a start-up process. The bootstrap circuit can include a capacitor and a diode. The power stage, the driver and the bootstrap circuit can be integrated on the same silicon. The capacitor can be implemented by at least one trench capacitor.