Bootstrap Diode Chip Integration for Compact Power Semiconductor Control
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Solution Overview
Problem
Existing power converters using power semiconductor elements require a significant area for installing resistive elements and diodes for bootstrap operations, which is inefficient.
Innovation Solution
A semiconductor apparatus with integrated diodes and current-limiting resistive elements on a semiconductor substrate, where the diode's anode is connected to a conductor and the cathode is connected via a line to a terminal, allowing for a compact bootstrap operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate resistive elements and diodes are used for bootstrap operation, then the bootstrap function can be achieved, but the installation area increases significantly
Solution Approach 1:
The patent combines the diode and resistive element into a single integrated semiconductor chip. The diode is formed with p-type and n-type semiconductor regions on the same substrate, and the resistive element is integrated on the same chip, reducing the number of discrete components from two separate elements to one unified device, thereby significantly reducing the installation area while maintaining the bootstrap operation function
Solution Approach 2:
The semiconductor chip serves multiple functions simultaneously: it provides the diode function for voltage rectification in the bootstrap circuit and the resistive element function for current limiting or voltage division. This multi-functional integration eliminates the need for separate discrete components, achieving both space savings and functional completeness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the required installation area by integrating the diode and resistive element on a semiconductor substrate, simplifying the configuration and enhancing space efficiency.
Implementation Method 1
having a PN junction of the diode formed by a p-type semiconductor region on the first face and an n-type semiconductor region on the second face
Data Source
AI summary
A semiconductor apparatus includes: a power semiconductor element; a control chip including a plurality of terminals including a first terminal and a second terminal, and being configured to control the power semiconductor element using a power supply voltage supplied to the second terminal; a first conductor for supplying a predetermined control voltage to the first terminal; a first line for supplying the power supply voltage to the second terminal; and semiconductor chip including a diode that is used for a bootstrap operation for generating the power supply voltage. The semiconductor chip includes: a semiconductor substrate: including a first face and a second face that are opposed to each other; and having a PN junction of the diode formed by a p-type semiconductor region on the first face and an n-type semiconductor region on the second face, an anode formed on the first face and joined to a surface of the first conductor, and a cathode formed on the second face and electrically connected to the second terminal via the first line.