Borate Photocuring Resin for High-Density i-Line Waveguides
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin compositions for optical waveguides lack sufficient photosensitivity for effective photocuring using direct imaging methods, particularly at i-line wavelengths, leading to inefficiencies in forming high-density optical waveguides with narrow pitches and multilayer structures.
Innovation Solution
A resin composition for optical waveguides containing an epoxy resin and a photocuring agent with a borate having a boron anion, which enhances photosensitivity to i-line light, allowing efficient photocuring and formation of high-density optical waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resin composition uses an epoxy resin with conventional photocuring agents, then heat resistance is improved, but photosensitivity at i-line wavelengths deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the photocuring agent system by introducing a borate compound with specific structural features (Formula 1) that has high absorption coefficient at i-line wavelengths (365-407 nm). This parameter change enables the resin composition to maintain epoxy resin heat resistance while achieving sufficient photosensitivity for direct imaging photocuring.
Solution Approach 2:
The patent creates a composite photocuring system combining a borate compound (Formula 1) with optional co-photocuring agents (Formulae 2-4) and epoxy resin. This composite material approach synergistically combines the thermal stability of epoxy resin with the enhanced i-line photosensitivity of the borate compound, resolving the contradiction between heat resistance and photosensitivity.
2Measurement precision
If the resin composition requires high degree of photosensitivity for direct imaging method, then positioning accuracy is improved, but curing completeness deteriorates
Solution Approach 1:
The patent optimizes the molecular structure parameters of the borate compound (Formula 1) to achieve balanced photosensitivity - high enough for precise direct imaging pattern formation but not so high that it causes premature or incomplete curing. The specific structural parameters (R1-R6 groups) are designed to provide appropriate light absorption characteristics.
Solution Approach 2:
The patent creates a dynamic curing system where the borate compound enables progressive curing - initial rapid curing for pattern definition followed by continued curing to achieve complete crosslinking. This dynamic behavior allows both high positioning accuracy during exposure and complete curing afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables high-degree photocurability, resulting in optical waveguides with reduced optical loss and improved heat resistance, suitable for high-density wiring applications.
Implementation Method 1
a process step of photocuring a resin composition for optical waveguides by irradiating the resin composition with a light ray
Implementation Method 2
The DI method has attracted a lot of attention from the art because the DI method allows an exposure pattern to be formed with high positioning accuracy even without using a photomask when irradiating the target with a light ray. A light source for use in the DI method has, in most cases, a wavelength of 365 nm or 407 nm, at which the resin composition for optical waveguides to be photocured needs to have a high degree of photosensitivity
Data Source
AI summary
A resin composition according to the present disclosure is designed for use in optical waveguides. The resin composition contains an epoxy resin (A) and a photocuring agent (B). The photocuring agent (B) includes a borate (B-1) having a boron anion.