Borderless Display Interconnect Layout for Minimal Inactive Borders
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Solution Overview
Problem
Electronic devices with displays often have unsightly and overly large inactive border areas that are not utilized for image display, which can detract from the device's aesthetic and functional performance.
Innovation Solution
The implementation of interconnect substrates with inwardly and outwardly facing contacts, supported by glass layers, allows for the routing of signals directly to pixels or pixel driver circuits, minimizing the need for substrate bending and reducing inactive border areas by integrating display panels and interconnect substrates using anisotropic conductive adhesive bonding, solder bonding, or thermal compression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional display panel structures are used, then manufacturing and signal routing are simplified, but inactive border areas become overly large and unsightly
Solution Approach 1:
The patent transitions from a planar display structure to a three-dimensional stacked structure by placing the display panel on top of the interconnect substrate. This vertical arrangement allows signal routing to occur in the Z-dimension through through-substrate vias, eliminating the need for lateral routing that would require large border areas. The display panel and interconnect substrate are bonded together through anisotropic conductive adhesive, creating a compact vertical integration that reduces the horizontal footprint and minimizes inactive border regions.
Solution Approach 2:
The patent introduces an interconnect substrate as an intermediary layer between the display panel and the housing. This interconnect substrate contains through-substrate vias that serve as conduits for signal routing, acting as a mediator that enables vertical signal transmission. The anisotropic conductive adhesive serves as another intermediary that bonds the display panel to the interconnect substrate while providing electrical connectivity through the adhesive layer, facilitating the transition from lateral to vertical signal routing architecture.
2Area of stationary object
If display panels are integrated with interconnect substrates, then inactive border areas are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the display system into separate functional modules: a display panel module and an interconnect substrate module. These modules can be manufactured independently using standardized processes, then assembled through bonding. The interconnect substrate with through-substrate vias is manufactured as a separate component, allowing parallel manufacturing of different layers. This segmentation enables modular assembly, where the display panel is bonded to the pre-fabricated interconnect substrate, reducing the need for complex multi-step integrated manufacturing while achieving the vertical integration benefits.
3Area of stationary object
If through-substrate vias are used for signal routing, then border areas are minimized, but manufacturing precision requirements increase
Solution Approach 1:
The anisotropic conductive adhesive serves as an intermediary layer that facilitates precise alignment between the display panel and interconnect substrate during bonding. This specialized adhesive material provides both mechanical bonding and electrical conductivity, while its anisotropic properties allow for controlled signal transmission. The adhesive layer acts as a buffer that can accommodate minor misalignments, reducing the stringency of alignment precision requirements compared to direct rigid bonding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes inactive display border regions, enhancing the visual appeal and operational efficiency of electronic devices by allowing for more compact and efficient display designs.
Implementation Method 1
integrating display panels and interconnect substrates using anisotropic conductive adhesive bonding
Implementation Method 2
integrating display panels and interconnect substrates using anisotropic conductive adhesive bonding, solder bonding, or thermal compression bonding
Implementation Method 3
integrating display panels and interconnect substrates using anisotropic conductive adhesive bonding, solder bonding, or thermal compression bonding
Data Source
AI summary
An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.