Borescope Heat Sink Assembly with Active Cooling
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Solution Overview
Problem
Current borescope designs face inefficiencies and reliability issues due to excessive heat generation, which affects performance and handling, as they rely on bulky, passively cooled heat sinks that fail to maintain acceptable temperatures effectively.
Innovation Solution
A heat sink assembly configuration where a first heat sink directs exhaust airflow through a second heat sink, allowing a single active cooling assembly to be used, reducing the need for additional cooling modules and enhancing airflow across both heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passively cooled heat sinks are used, then the device structure is simple, but the heat dissipation efficiency is insufficient and the device becomes too hot
Solution Approach 1:
The patent replaces passive mechanical heat dissipation structures with an active cooling system using Peltier devices (electrocooling). This substitution of mechanical/conductive cooling with electro-thermal active cooling enables precise temperature control and significantly improved heat dissipation efficiency, resolving the contradiction between structural simplicity and cooling effectiveness.
Solution Approach 2:
The patent changes the thermal management approach from passive conduction to active electrocooling by applying electrical current to Peltier devices. This parameter change (from passive to active cooling) transforms the thermal control capability, allowing the system to maintain lower temperatures while improving overall cooling efficiency.
2Temperature
If larger heat sinks are used to increase surface area, then heat dissipation improves, but the device size and weight increase
Solution Approach 1:
The patent replaces bulky passive heat sinks with compact active Peltier cooling devices. This substitution achieves superior heat dissipation capability in a much smaller, lighter package, directly resolving the contradiction between heat dissipation performance and device weight.
Solution Approach 2:
The patent transforms the heat dissipation mechanism from surface-area-dependent passive conduction to electrically-driven active cooling. This parameter change enables high heat dissipation efficiency without requiring large physical dimensions, thereby reducing device weight while maintaining effective thermal management.
3Temperature
If active cooling assemblies are added to each heat sink, then cooling efficiency improves, but the device complexity increases
Solution Approach 1:
The patent merges multiple cooling functions into a single integrated Peltier device located at the video head. Instead of adding separate cooling assemblies to each heat-generating component, the invention consolidates thermal management into one active cooling unit that cools the critical video head components, thereby improving cooling efficiency while minimizing device complexity.
Solution Approach 2:
The single Peltier device performs multiple cooling functions simultaneously, serving as a universal cooling solution for various heat-generating components at the video head. This multi-functional approach achieves high cooling efficiency without requiring multiple specialized cooling assemblies, thus reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the cooling efficiency and reliability of borescope components, reduces size and weight, and enhances operator handling by maintaining lower temperatures and improving performance.
Implementation Method 1
The Peltier device can be in contact with the first circuit board and can transfer heat from the first circuit board to a heat sink
Implementation Method 2
The heat sink can be in contact with the Peltier device and can receive thermal energy from the Peltier device
Implementation Method 3
The heat sink can be in contact with the Peltier device and can receive thermal energy from the Peltier device
Implementation Method 4
a first heat sink that is positioned adjacent to a second heat sink such that exhaust airflow from the first heat sink is directed through the second heat sink
Data Source
AI summary
Modules, systems, and methods are provided for cooling components of an inspection or testing apparatus, such as a borescope. In some exemplary embodiments, the modules include two heat sinks, with the top-most heat sink having a fan assembly approximately centrally disposed therein. The fan assembly can be operated to draw air into the top-most heat sink, and then exhaust airflow out of the top-most heat sink such that the exhaust air passes across at least a portion of the second heat sink to help cool both the first and second heat sinks, and components of the apparatus associated therewith, using the same fan assembly. As a result, the components of the apparatus can be cooled more easily, and the performance and efficiency of these components is improved, all while reducing the overall size and weight of the inspection apparatus.