Boron Film Adhesion via Nitrogen Interface Layer
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Solution Overview
Problem
Boron-based films formed through CVD lack sufficient adhesion to substrates, leading to peeling issues during device integration manufacturing, and existing techniques for improving adhesion, such as surface treatment and interface layers, have not been effective.
Innovation Solution
A method involving the formation of an adhesion layer containing elements from the substrate surface and nitrogen, followed by the deposition of a boron-based film, using techniques like plasma CVD, to enhance the adhesion between the boron film and the substrate, with specific processes including forming an initial boron film and subsequent plasma processing to create an interface adhesion layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a boron-based film is formed through CVD on a substrate, then the film provides high etching resistance and selectivity, but the film exhibits poor adhesion to the substrate
Solution Approach 1:
The patent introduces an adhesion layer as an intermediary between the substrate and the boron-based film. This adhesion layer contains nitrogen and at least one element from the substrate surface, creating a transition zone that bonds to both the substrate and the boron film, thereby resolving the adhesion problem while preserving the high etching resistance of the boron-based film
Solution Approach 2:
The patent creates a composite structure consisting of the substrate, the adhesion layer with nitrogen-containing compounds, and the boron-based film. This composite material approach combines the high etching resistance of boron with the adhesion properties of nitrogen-containing compounds, achieving both required properties simultaneously
2Reliability
If the thickness of the hard mask film is increased to 1 μm or more, then the etching resistance is improved, but the manufacturing complexity and material consumption increase
Solution Approach 1:
The patent changes the compositional parameters of the hard mask by incorporating nitrogen into the boron-based film or adhesion layer. This compositional modification enhances both adhesion and etching resistance, allowing for thinner film designs that reduce manufacturing complexity while maintaining required performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the adhesion of boron-based films to substrates, reducing peeling and ensuring strong bonding, as demonstrated by increased adhesion density and resistance to film peeling, even under stress conditions.
Implementation Method 1
forming an adhesion layer containing an element contained in a surface of the substrate and nitrogen
Implementation Method 2
forming the boron-based film on the adhesion layer
Data Source
AI summary
A method of forming a boron-based film mainly containing boron on a substrate includes forming, on the substrate, an adhesion layer containing an element contained in a surface of the substrate and nitrogen, and subsequently, forming the boron-based film on the adhesion layer.