Boron Nitride Agglomerate Coating for Thermal Conductivity
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Solution Overview
Problem
Boron nitride fillers used in resin compositions for heat radiation face challenges such as anisotropic thermal conductivity, reduced thermal conductivity due to pores, low bonding strength, and poor chemical affinity with other materials, which affect their performance in high-intensity light emitting devices and printed circuit boards.
Innovation Solution
A resin composition incorporating boron nitride agglomerates coated with a polymer layer containing silicon-based compounds, such as polysilazane and amino silane, which increases thermal conductivity and bonding strength, and improves chemical affinity with the resin, while also incorporating aluminum oxide for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If plate-shaped boron nitride is agglomerated together to resolve anisotropic heat conductivity, then heat radiation performance is improved, but thermal conductivity decreases due to pores in the agglomerate
Solution Approach 1:
The patent applies local quality by filling pores only in specific regions of the boron nitride agglomerate with resin composition, rather than uniformly throughout. This selective filling approach maintains the isotropic heat radiation performance while minimizing the impact on overall thermal conductivity by targeting only the pore regions that need correction.
Solution Approach 2:
The patent creates a composite structure by combining boron nitride agglomerate with resin composition filled in the pores. This composite material approach allows the boron nitride to provide heat radiation performance while the resin fills the void spaces, creating a material that balances both thermal conductivity and heat radiation properties.
2Temperature
If plate-shaped boron nitride is agglomerated together to resolve anisotropic heat conductivity, then heat radiation performance is improved, but bonding strength decreases due to low bonding strength within the plate-shaped boron nitride
Solution Approach 1:
The patent uses resin composition as an intermediary material that fills the pores between plate-shaped boron nitride particles. This intermediary substance acts as a bonding agent that connects the individual plates, significantly improving the overall bonding strength of the agglomerate while preserving the heat radiation performance provided by the boron nitride structure.
Solution Approach 2:
The patent creates a composite structure where resin composition is integrated within the boron nitride agglomerate pores. This composite material approach enhances bonding strength by combining the heat radiation capabilities of boron nitride with the bonding properties of the resin, creating a synergistic material system.
3Quantity of substance
If boron nitride is used as filler, then heat conductivity is improved, but chemical affinity with other materials decreases due to low coefficient of friction and high lubricity
Solution Approach 1:
The patent introduces resin composition as an intermediary substance that fills the pores of boron nitride agglomerates. This intermediary material provides chemical affinity and bonding capability between the boron nitride filler and the surrounding matrix materials, while the boron nitride itself maintains its heat conductivity function. The resin acts as a bridge that enables chemical interaction without compromising thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves thermal conductivity of 18 W/mK or more, peel strength of 0.8 kgf/cm² or more, and improved bend strength, addressing the limitations of boron nitride fillers by enhancing their thermal and mechanical properties.
Implementation Method 1
Said inorganic filler may include pores formed in the boron nitride agglomerate, wherein at least some of the pores are filled with the polymer
Implementation Method 2
a coating layer formed on the boron nitride agglomerate and including a polymer having the unit as defined in claim 1
Data Source
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AI summary
An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate (10) and a coating layer (20) formed on the boron nitride agglomerate (10) and including a -Si-R-NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.