Metal-Oxide Boron Nitride Epoxy for Thermally Conductive PCB Insulation
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Solution Overview
Problem
Printed circuit boards face challenges with heat dissipation due to the low thermal conductivity and adhesion issues of traditional insulating layers, particularly with boron nitride fillers which have excellent thermal conductivity but poor wettability and adhesion with epoxy resins.
Innovation Solution
An epoxy resin composition incorporating boron nitride with a metal oxide film, such as titanium oxide, aluminum oxide, or zirconium oxide, is used to enhance thermal conductivity and adhesion strength, improving heat dissipation and reliability by forming a stable metal oxide film on the boron nitride surface through atomic layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If boron nitride is used as an inorganic filler to improve thermal conductivity, then heat dissipation performance is enhanced, but adhesion strength with epoxy resin deteriorates due to low surface affinity
Solution Approach 1:
A silane coupling agent is introduced as an intermediary substance between the boron nitride filler and the epoxy resin matrix. The silane coupling agent contains both inorganic-binding groups that attach to the boron nitride surface and organic-binding groups that bond with the epoxy resin, thereby mediating the interface and improving adhesion strength while preserving the thermal conductivity benefits of boron nitride
2Temperature
If boron nitride is used as an inorganic filler to improve thermal conductivity, then heat dissipation is enhanced, but wettability with epoxy resin deteriorates due to low surface affinity
Solution Approach 1:
The silane coupling agent serves as a wetting intermediary that reduces the interfacial tension between the hydrophobic boron nitride surface and the epoxy resin. By modifying the boron nitride surface chemistry, the silane coupling agent improves wettability and ensures uniform distribution of filler particles throughout the resin matrix during the manufacturing process
3Temperature
If high content of boron nitride is used to enhance heat dissipation, then thermal conductivity is improved, but processability deteriorates due to poor adhesion and aggregation
Solution Approach 1:
The silane coupling agent acts as a dispersing intermediary that prevents aggregation of boron nitride particles even at high concentrations. By providing steric and chemical barriers between particles, the coupling agent enables uniform dispersion and maintains processability while allowing high filler content to achieve the desired thermal conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin composition achieves high thermal conductivity, excellent adhesion strength, and processability, resulting in enhanced heat dissipation and reliability of printed circuit boards with improved peel strength and reduced risk of circuit pattern separation.
Implementation Method 1
a metal oxide film which is formed on a surface of the boron nitride... excellent adhesion strength
Implementation Method 2
boron nitride may have excellent thermal conductivity and heat dissipation... high thermal conductivity
Data Source
Figure 1~2
AI summary
An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.