Boron Nitride Foam Composite for Thermal Management
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Solution Overview
Problem
Current thermal management solutions for electronic components, such as massive metal heat sinks and phase change materials, are bulky, inefficient in heat evacuation, and risk short-circuiting due to high thermal conductivity, necessitating a compact, lightweight, and electrically insulating material for effective temperature regulation.
Innovation Solution
A composite material comprising phase change materials (PCMs) incorporated into the interstices of a continuous boron nitride (BN) structure, with specific surface portions devoid of PCM to ensure electrical insulation and enhanced thermal conductivity, utilizing BN(C) foams with controlled porosity and carbon content for improved thermal and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If phase change materials (PCMs) are used to absorb and store heat, then heat storage capacity is improved, but thermal conductivity is too low (0.15-0.25 W/mK) to effectively evacuate heat
Solution Approach 1:
The patent creates a composite material by incorporating PCMs into the interstices of a continuous boron nitride structure. This composite combines the high heat storage capacity of PCMs with the high thermal conductivity of boron nitride, resolving the contradiction between heat storage and heat evacuation efficiency
Solution Approach 2:
The patent utilizes the porous structure of boron nitride foams, incorporating PCMs into the interstices while maintaining the continuous conductive framework. The porous structure allows PCM integration without compromising thermal conductivity pathways
2Temperature
If materials with high thermal conductivity are incorporated to improve heat evacuation, then thermal conductivity is improved, but electrical conductivity increases causing short-circuit risks
Solution Approach 1:
Boron nitride serves as an intermediary material that transfers heat efficiently while blocking electrical conduction. It mediates between the heat source and the PCM, enabling thermal management without electrical short-circuiting
Solution Approach 2:
The boron nitride structure creates an electrically inert environment around the PCM, preventing electrical conduction while allowing thermal energy transfer. This inert barrier protects against short-circuiting
3Temperature
If massive metal heat sinks are used for cooling, then heat evacuation is improved, but the device becomes bulky and heavy
Solution Approach 1:
The patent changes the material parameters by using boron nitride foam with optimized porosity and density. This allows achieving high thermal conductivity with significantly reduced mass compared to solid metal heat sinks
Solution Approach 2:
The composite structure of boron nitride foam with PCM incorporates lightweight porous material while maintaining thermal performance, reducing overall mass compared to traditional solid metal heat sinks
4Volume of moving object
If the composite material is made thinner to reduce space occupation, then space efficiency is improved, but thermal contact resistance increases
Solution Approach 1:
The boron nitride foam structure acts as a thin, flexible thermal interface layer that maintains low thermal contact resistance even at reduced thickness. The continuous conductive framework ensures effective heat transfer across thin profiles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves significant gains in thermal conductivity while maintaining low weight and electrical insulation, effectively managing heat absorption and storage, ensuring optimal component performance and safety in confined environments.
Implementation Method 1
these materials have the capacity to store the surrounding heat thanks to their high enthalpy of fusion (typically around 210 J/g), and by absorbing the heat they limit the rise in temperature of their environment
Implementation Method 2
BN is an excellent electrical insulator while being an excellent thermal conductor... Its thermal conductivity, although theoretically lower than graphene, remains very high (around 2000 W/mK in theory), compared to copper (400 W/mK) conventionally used
Data Source
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AI summary
The present invention relates to a boron nitride (BN(C)) composite material in the form of a continuous structure, and a phase change material (PCM) included inside said continuous structure of BN(C), the method for manufacturing same and the components that comprise same.