Boron Nitride Heat Dissipation Sheet for Insulation and Adhesion
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Solution Overview
Problem
Existing heat dissipation sheets fail to meet the increasing demands for improved thermal conductivity and insulating properties due to miniaturization and higher heat generation in electronic devices.
Innovation Solution
A heat dissipation sheet comprising boron nitride powder surface-treated with a reactive silicone oil, achieving a surface hardness of 60 to 95 Asker C and a dielectric breakdown voltage of 15 kV/mm, with a void area rate of 5.0% or less, enhancing thermal conductivity and insulating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If boron nitride powder is used to improve thermal conductivity, then heat dissipation performance is enhanced, but insulating property and adhesion are insufficient
Solution Approach 1:
Silicone oil is introduced as an intermediary substance that coats the boron nitride powder particles. This intermediary layer improves the wettability of the powder with the resin matrix, enhances adhesion, and maintains the insulating properties while preserving the high thermal conductivity of the boron nitride particles.
Solution Approach 2:
The surface properties of the boron nitride powder are modified by changing its chemical composition through silicone oil treatment. This parameter change in surface chemistry improves the interaction between the filler and resin, leading to better adhesion and insulating properties without compromising thermal conductivity.
2Temperature
If boron nitride powder is used to improve thermal conductivity, then heat dissipation performance is enhanced, but adhesion to heat-generating elements is insufficient
Solution Approach 1:
Silicone oil serves as a mediating agent between the boron nitride powder and the resin matrix, improving the interfacial adhesion. The oil treatment creates a compatible interface that enhances bonding strength while maintaining the thermal conductivity pathway through the boron nitride particles.
Solution Approach 2:
The surface energy and chemical composition of the boron nitride powder are altered through silicone oil treatment, creating better interfacial compatibility with the resin and heat-generating elements, thereby improving adhesion strength.
3Temperature
If conventional boron nitride powder is used, then thermal conductivity is achieved, but void formation reduces insulating property
Solution Approach 1:
Silicone oil acts as a lubricant and wetting agent that fills gaps between boron nitride particles and resin matrix, reducing void formation. This intermediary substance improves the packing density and eliminates air pockets that would otherwise compromise insulating properties.
Solution Approach 2:
The invention addresses void formation by improving the density and reducing porosity of the composite material through silicone oil treatment, thereby eliminating harmful pores while maintaining the desired thermal conductivity pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The treated boron nitride powder improves thermal conductivity and insulating properties, ensuring effective heat dissipation and adhesion to heat-generating elements while minimizing dielectric breakdown.
Implementation Method 1
a boron nitride powder, which has characteristics such as a high thermal conductivity
Implementation Method 2
attach a heat-generating electronic component or a printed wiring board on which a heat-generating electronic component is mounted to a heat sink via an electrically insulating thermal interface material
Data Source
Figure 1~2
Figure 3
AI summary
A heat dissipation sheet of the present invention has a surface hardness of 60 degrees to 95 degrees in terms of an Asker C hardness and a dielectric breakdown voltage of 15 kV/mm or more. According to the present invention, a heat dissipation sheet having an excellent thermal conductivity and insulating property can be provided.