Boron Nitride Resin Composition for High Thermal Conductivity
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Solution Overview
Problem
Current resin compositions face challenges in achieving concurrent high thermal conductivity and high peel strength due to the increase in boron nitride content, which compromises dielectric characteristics and moldability.
Innovation Solution
A resin composition incorporating a polyphenylene ether compound, a curing agent, and a boron nitride filler with a specific particle size distribution, featuring at least two peaks in the range of 0.8 to 30.0 μm, including one peak between 0.8 to 5.0 μm and another between 5.0 to 30.0 μm, to enhance thermal conductivity and peel strength while maintaining low dielectric characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the amount of boron nitride filler is increased to enhance thermal conductivity, then thermal conductivity is improved, but peel strength decreases
Solution Approach 1:
The patent changes the particle size distribution parameters of boron nitride filler by introducing a bimodal distribution with specific D10, D50, and D90 values. This parameter optimization allows achieving high thermal conductivity (0.8 W/mK or more) while maintaining adequate peel strength (70 N/15mm or more) by balancing filler packing and resin matrix adhesion
Solution Approach 2:
The patent creates a composite filler system combining boron nitride particles with specific particle size distribution (0.8-30.0 μm range with bimodal peaks) in a resin composition containing polyphenylene ether and crosslinking curable compound. This composite structure achieves synergistic effects where the optimized particle distribution maintains both thermal conductivity enhancement and mechanical adhesion properties
2Temperature
If the amount of boron nitride filler is increased to enhance thermal conductivity, then thermal conductivity is improved, but dielectric characteristics deteriorate
Solution Approach 1:
The patent optimizes the particle size distribution parameters of boron nitride filler to achieve a balance between thermal conductivity and dielectric properties. By controlling D10=1.0-3.0 μm, D50=3.0-10.0 μm, and D90=10.0-30.0 μm, the composition achieves thermal conductivity of 0.8 W/mK or more while maintaining dielectric constant of 3.8 or less and dielectric loss tangent of 0.012 or less at 10 GHz
Solution Approach 2:
The patent applies local quality by creating regions with different filler concentrations through bimodal particle distribution. The smaller particles (0.8-5.0 μm peak) fill interstices and provide adhesion, while larger particles (5.0-30.0 μm peak) provide thermal conductivity pathways, achieving local optimization of both thermal and dielectric properties
3Temperature
If the amount of boron nitride filler is increased to enhance thermal conductivity, then thermal conductivity is improved, but moldability deteriorates
Solution Approach 1:
The patent changes the particle size distribution parameters to optimize flow and packing characteristics. The bimodal distribution with D10=1.0-3.0 μm, D50=3.0-10.0 μm, and D90=10.0-30.0 μm provides good fluidity during molding while achieving high thermal conductivity (0.8 W/mK or more) and adequate peel strength (70 N/15mm or more) in the cured product
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a cured product with low dielectric characteristics, high thermal conductivity, and excellent peel strength, suitable for applications in electronic devices such as prepregs, metal-clad laminates, and wiring boards.
Implementation Method 1
a resin composition for a substrate which contains a polyphenylene ether compound, a curing agent reactable with the polyphenylene ether compound, and an inorganic filler including a boron nitride filler
Implementation Method 2
a particle size distribution of the inorganic filler which is on a measurement of a laser diffraction-based particle size distribution measuring method
Data Source
AI summary
A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.