Boron Nitride Aggregate Resin for PCB Thermal Conductivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current resin compositions for printed circuit boards face challenges in achieving optimal thermal conductivity and copper foil peel strength due to the addition of inorganic fillers, which can lead to deteriorated heat-resistant properties, reduced elastic modulus, and increased likelihood of cracks or voids.
Innovation Solution
Incorporating a boron nitride particle aggregate, where primary hexagonal boron nitride particles are stacked to form the aggregate, into a resin composition comprising a cyanate compound and/or a maleimide compound, enhancing thermal conductivity and copper foil peel strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a larger amount of inorganic filler is added to improve thermal conductivity, then thermal conductivity is improved, but moldability deteriorates and cracks or voids occur
Solution Approach 1:
The patent uses a composite inorganic filler system combining boron nitride particles (excellent thermal conductivity) with alumina particles (good moldability and cost-effectiveness). This composite approach allows achieving high thermal conductivity while maintaining acceptable moldability, as the alumina component helps fill gaps and improve resin-filler interaction.
Solution Approach 2:
The patent applies surface treatment to specific regions of the inorganic filler particles. The boron nitride particles are subjected to surface treatment with silane coupling agents or other surface modifiers to improve their interfacial bonding with the resin matrix locally at the particle surface, preventing cracks and voids while maintaining thermal conductivity.
2Temperature
If a larger amount of inorganic filler is added to improve thermal conductivity, then thermal conductivity is improved, but heat resistant properties upon moisture absorption deteriorate
Solution Approach 1:
The composite filler system combines boron nitride (hydrophobic, excellent thermal conductivity) with alumina (good chemical stability). The boron nitride component provides inherent moisture resistance due to its hydrophobic nature, while the alumina fills voids and provides structural stability, together maintaining heat resistant properties even when moisture is absorbed.
Solution Approach 2:
Surface treatment agents act as intermediaries between the inorganic filler particles and the resin matrix. These surface treatments create a protective interface that prevents moisture penetration at the filler-resin interface, thereby maintaining heat resistant properties upon moisture absorption while allowing high filler content for thermal conductivity.
3Temperature
If a larger amount of inorganic filler is added to improve thermal conductivity, then thermal conductivity is improved, but elastic modulus decreases
Solution Approach 1:
The patent employs a composite filler system where alumina particles (high elastic modulus) are combined with boron nitride particles (high thermal conductivity). The alumina component compensates for the potential reduction in elastic modulus by providing structural rigidity, while the boron nitride ensures high thermal conductivity.
Solution Approach 2:
The patent optimizes the particle size distribution and shape parameters of the inorganic fillers. By controlling particle size, aspect ratio, and size distribution, the resin matrix can better wrap around filler particles, maintaining elastic modulus while allowing high filler loading for thermal conductivity.
4Temperature
If a larger amount of inorganic filler is added to improve thermal conductivity, then thermal conductivity is improved, but copper foil peel strength reduces due to insufficient close contact
Solution Approach 1:
Surface treatment agents serve as intermediaries that improve the interfacial bonding between inorganic filler particles and the resin matrix. This enhanced interface ensures close contact and strong adhesion, preventing copper foil peel strength reduction even at high filler concentrations required for high thermal conductivity.
Solution Approach 2:
The composite filler system creates a more uniform distribution pattern where alumina particles can fill gaps between boron nitride particles, improving the overall resin-filler contact area. This enhanced contact network maintains copper foil peel strength while achieving high thermal conductivity through the boron nitride component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition exhibits improved thermal conductivity and copper foil peel strength, maintaining excellent moldability and heat-resistant properties while reducing the risk of cracks and voids.
Implementation Method 1
the internal heat density of electronic equipment has kept increasing year by year... there is a demand for members having high thermal conductivity and electrical insulating properties and efficiently dissipating heat
Implementation Method 2
a resin composition comprising a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C)
Data Source
AI summary
The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.