Boron Nitride Thermal Sheet for Flexible Thin Heat Dissipation
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Solution Overview
Problem
Conventional thermally conductive sheets with boron nitride (BN) molded articles have poor flexibility and are not suitable for curved surfaces or high tightening torque applications, and they struggle to achieve high thermal conductivity while maintaining a thickness of 300 µm or less.
Innovation Solution
A thermally conductive sheet is developed by dispersing secondary agglomerated particles of scale-shaped boron nitride in a thermosetting silicone resin, with specific particle size, porosity, and strength characteristics, and a loading rate of 50-70% by volume, to enhance thermal conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BN molded articles are used to achieve high thermal conductivity, then thermal conductivity is improved, but flexibility deteriorates
Solution Approach 1:
The patent changes the particle size parameter of boron nitride from conventional large molded articles to fine particles with specific size distribution (D10: 1-10 μm, D50: 10-30 μm, D90: 30-50 μm). This parameter change enables the material to achieve high thermal conductivity while maintaining flexibility, as the fine particles can conform to curved surfaces and be molded into thin sheets (300 μm or less thickness) without the rigidity of traditional BN molded articles.
Solution Approach 2:
The patent creates a composite material by dispersing boron nitride particles in a resin matrix. This composite structure combines the high thermal conductivity of BN particles with the flexibility and moldability of the resin, resolving the contradiction between thermal performance and mechanical flexibility. The resin binder holds the fine BN particles together while allowing the sheet to be bent and conform to curved surfaces.
2Ease of operation
If sheet thickness is reduced to 300 μm or less for better installation, then installation ease is improved, but structural integrity deteriorates
Solution Approach 1:
The patent changes the particle size parameters to fine distributions that can be densely packed in thin sheets. The specific size range (D10: 1-10 μm, D50: 10-30 μm, D90: 30-50 μm) allows the material to maintain structural integrity at thicknesses of 300 μm or less, as the fine particles create a more uniform and mechanically stable composite structure compared to larger particles.
Solution Approach 2:
The composite material structure provides mechanical strength to thin sheets through the resin matrix that binds the BN particles together. This composite construction allows the sheet to be thin enough for easy installation (300 μm or less) while maintaining sufficient structural integrity to withstand handling and mounting stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet achieves high thermal conductivity while maintaining flexibility, allowing for effective heat dissipation in electronic components, even on curved surfaces and under high torque, and can be thinned to 200 µm or less for improved installation methods.
Implementation Method 1
a thermosetting resin comprising a silicone resin of addition reaction type
Implementation Method 2
dispersing, in a thermosetting resin comprising a silicone resin of addition reaction type, secondary agglomerated particles obtained by agglomerating primary particles of scale-shaped boron nitride
Data Source
AI summary
A sheet having excellent thermal conductivity is provided, and in particular, a thermally conductive sheet suitable as a heat-dissipating member for electronic components is provided. A thermally conductive sheet obtained by dispersing, in a thermosetting resin, a secondary agglomerated particle obtained by agglomerating primary particles of scale-shaped boron nitride, wherein the secondary agglomerated particle has an average particle size of 50 µm or more and 120 µm or less, and a porosity of 51% or more and 60% or less, and a particle strength of the secondary agglomerated particle at a cumulative destruction rate of 63.2% is 0.2 MPa or more and 2.0 MPa or less, and a loading rate of the secondary agglomerated particle in the thermally conductive sheet is 50% by volume or more and 70% by volume or less.