Boron Nitride Laminate for Thick Copper Heat Dissipation and Bonding

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Solution Overview

Problem

Conventional resin compositions containing boron nitride struggle to balance thermal conductivity and adhesiveness, especially with thick copper circuit patterns, leading to difficulties in heat dissipation and reliability in electronic devices.

Innovation Solution

A laminate comprising a metal substrate, an insulating layer with boron nitride and an inorganic filler, and a patterned metal layer thicker than 300 μm, where the insulating layer includes boron nitride aggregated particles and an inorganic filler like aluminum oxide, enhancing thermal conductivity and adhesiveness by dispersing stress and preventing interlayer cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional resin compositions containing boron nitride are used as insulating layers, then thermal conductivity is enhanced, but adhesiveness between thick copper circuit patterns and the insulating layer deteriorates

Engineering Contradiction:

Improvethermal conductivityVSAvoidadhesiveness

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The invention changes the particle morphology parameter of boron nitride from conventional spherical or irregular shapes to platelet shapes with specific aspect ratios (2.0 or more). This parameter change enables the insulating layer to maintain high thermal conductivity while achieving sufficient adhesiveness to thick copper circuit patterns, resolving the contradiction between thermal conductivity and adhesiveness

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite insulating layer by combining platelet-shaped boron nitride particles with a thermosetting resin matrix. The composite structure allows the boron nitride platelets to provide thermal conduction pathways while the resin matrix ensures proper adhesion to the copper patterns, simultaneously achieving both thermal conductivity and adhesiveness

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If ceramic substrates are used for heat dissipation, then thermal conductivity is improved, but workability and multi-layering capability deteriorate

Engineering Contradiction:

Improvethermal conductivityVSAvoidworkability

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The invention replaces expensive ceramic substrates with a resin-based insulating layer containing boron nitride fillers. This substitution uses a more manufacturable, flexible material that can be easily processed into multi-layer structures while providing sufficient thermal conductivity for heat dissipation applications

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The invention changes the material composition parameter from ceramic to resin-based composite, which fundamentally improves workability and multi-layering capability while maintaining acceptable thermal conductivity through proper filler selection and arrangement

Inventive Principle:

Principle #35Parameter changes

3Loss of energy

If ceramic substrates are used, then thermal conductivity is enhanced, but the copper circuit is easily peeled off during cooling-heating cycles due to large difference in linear expansion coefficient

Engineering Contradiction:

Improvethermal conductivityVSAvoidlinear expansion coefficient compatibility

Core Design Contradiction:

Loss of energyVSStability of the object's composition

Solution Approach 1:

The invention changes the material composition from ceramic to resin-based composite, which fundamentally alters the thermal expansion characteristics. The resin matrix has a linear expansion coefficient much closer to copper than ceramic materials, eliminating the peeling problem during thermal cycling while maintaining thermal conductivity through boron nitride fillers

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminate effectively enhances thermal conductivity and adhesiveness, even with thick metal layers, thereby improving the reliability and performance of electronic devices by maintaining strong bonding and efficient heat dissipation.

Implementation Method 1

hexagonal boron nitride is higher in thermal conductivity in the plane direction than in the thickness direction

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heat of the adherend is dissipated through the insulating resin layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11798863B2Laminate and electronic device

Publication Date: 2023.10.24 SEKISUI CHEMICAL CO LTD

AI summary

The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 μm or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.