Boronic Acid Resist Underlayer Composition for High-Sensitivity Patterning

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Solution Overview

Problem

Existing resist underlayer films face issues with intermixing with resist films and poor pattern formation sensitivity, particularly in advanced microfabrication processes using EUV light or electron beams.

Innovation Solution

A resist underlayer film-forming composition containing a polymer with a boronic acid structure, solvent, and optionally a crosslinking agent and curing catalyst, which forms a resist underlayer film that allows for high sensitivity pattern formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional resist underlayer film is used, then the substrate is protected during etching, but intermixing with the resist film occurs and pattern formation sensitivity is poor

Engineering Contradiction:

Improveprotective functionVSAvoidpattern formation sensitivity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the chemical parameters of the underlayer film by incorporating boronic acid structures and specific solvent systems (alkylene glycol monoalkyl ethers). This chemical modification enables the underlayer to maintain protective function while preventing intermixing with the resist film, thereby improving pattern formation sensitivity without sacrificing reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite underlayer system combining polymer (A) with boronic acid structure, solvent (B) from specific groups, and optionally crosslinking agent (C) and curing catalyst (D). This composite formulation achieves both high protective reliability and excellent pattern formation sensitivity by synergistically combining multiple functional components

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If a resist underlayer film is introduced to solve substrate influence, then pattern formation sensitivity improves, but intermixing with resist film may occur

Engineering Contradiction:

Improvepattern formation sensitivityVSAvoidresist film insolubility

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The underlayer film acts as an intermediary barrier between the substrate and the resist film. By using boronic acid-containing polymers and specific solvents, this intermediary layer prevents direct interaction and intermixing between the resist and substrate, maintaining both pattern formation sensitivity and resist film stability

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different chemical properties to different layers: the underlayer has boronic acid structures and specific solvent characteristics that differ from the resist film above it. This local differentiation in chemical composition prevents intermixing while allowing each layer to perform its specific function optimally

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables high sensitivity resist pattern formation, addressing intermixing issues and enhancing the microfabrication process for semiconductor elements.

Implementation Method 1

a polymer (A) having a boronic acid structure

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentEP4636486A1Composition for forming resist underlayer film

Publication Date: 2025.10.22 NISSAN CHEM CORP

AI summary

A resist underlayer film-forming composition, containing a polymer (A) having a boronic acid structure and a solvent (B).