Pluggable Transceiver BOSA Thermal Path Isolation

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Solution Overview

Problem

Single-packaged bi-directional optical sub-assemblies (BOSAs) face challenges with crosstalk noise and thermal stability due to the close proximity of transmitter and receiver units, as well as increased heat generation from housing multiple devices in a single package.

Innovation Solution

The optical transceiver design incorporates a metal-based structure without adhesives or soldering, featuring a heat conductor that isolates heat dissipation paths from the IC to the cage, while grounding the transmitter and receiver units independently to reduce crosstalk and enhance thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If transmitter and receiver units are installed in a single package, then device integration is improved, but crosstalk noise increases

Engineering Contradiction:
Improvedevice integrationVSAvoidcrosstalk noise
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the single package into distinct transmitter and receiver units with independent grounding. Each unit has its own ground connection path, separating the electrical environments to prevent crosstalk while maintaining physical integration in one package.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces independent grounding paths as intermediaries between the transmitter and receiver units. These separate ground connections act as mediators that isolate the electrical fields, preventing harmful electromagnetic interference while allowing both units to coexist in the same package.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If multiple devices are installed in a single package, then device integration is improved, but heat generation increases

Engineering Contradiction:
Improvedevice integrationVSAvoidheat generation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent segments the heat dissipation paths by providing independent grounding paths for each unit. This segmentation allows heat from the transmitter and receiver to be dissipated through separate channels, preventing heat accumulation while maintaining integrated packaging.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts heat dissipation pathways from the shared package structure by implementing separate grounding paths. Each unit's heat is conducted away through its own dedicated path, effectively removing the heat management bottleneck that would otherwise result from dense integration.

Inventive Principle:
Principle #2Taking out (Extraction)

3Device complexity

If transmitter and receiver units are placed close together, then device integration is improved, but thermal stability deteriorates

Engineering Contradiction:
Improvedevice integrationVSAvoidthermal stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The patent segments the thermal environment by providing separate grounding paths for each unit. This creates distinct thermal zones that prevent heat transfer between units, maintaining thermal stability even when units are physically close together.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The independent grounding paths serve as thermal intermediaries that isolate the thermal fields of the transmitter and receiver. These mediators prevent thermal coupling between units, allowing close physical integration without compromising thermal stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively improves crosstalk performance and heat dissipation, ensuring reliable operation of the single-packaged BOSA by isolating noise sources and efficiently managing heat generated by both the optical module and ICs.

Implementation Method 1

The heat conductor comes in thermally contact with the BOSA, the base and the cover to secure a heat conducting path from the BOSA to the base and to the cover independent of the path from the IC to the cage through the sub-base

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The sub-base is in thermally contact with the IC on the PCB

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

Such a BOSA enables to transmit an optical signal to an optical fiber and to receive another optical signal from the optical fiber concurrently by differentiating the wavelengths to each other

Methodology Applied
Scientific EffectWavelength division multiplexing: Filter (optical)

Data Source

PatentUS8104977B2Pluggable transceiver with bi-directional optical sub-assembly
Publication Date: 2012.01.31 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US8104977B2 patent drawing
  • US8104977B2 patent drawing
  • US8104977B2 patent drawing

AI summary

An optical transceiver is disclosed, in which the transceiver installs a BOSA and has an additional heat conducting path from the BOSA to the cover and to the base independent of the path from the IC to the cover. The optical transceiver includes a heat conductor that comes in thermally contact with the BOSA, the cover and the base. The heat conductor, which is made of metal sheet, has a ceiling piece that comes in contact with the cover and a pair of legs with the bottom surface that comes in contact with the base in both sides of the BOSA.