Bossed Underlayment Tiles for Heating Wire Retention and Bonding
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Solution Overview
Problem
Existing in-floor heating systems face issues with securing wires or pipes, leading to uneven heating and potential damage, as well as challenges in facilitating the interaction between successive adhesive layers for a cohesive flooring system.
Innovation Solution
A system featuring a base with protrusions, or bosses, that securely position and maintain heating elements, allowing for communication between adhesive layers applied above and below the underlayment, and incorporating features like hollow bosses for weight reduction and enhanced bonding, along with openings for drainage and air permeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wires are not secured between adjacent studs, then installation is simpler, but heating becomes uneven and wires may be damaged
Solution Approach 1:
The underlayment is divided into modular tiles with integrated studs, allowing the heating wire to be securely positioned between adjacent studs on each tile. This segmentation provides both structural support for wire securing and simplifies installation through modular assembly.
Solution Approach 2:
The studs are merged directly into the underlayment tile structure rather than being separate components. This integration ensures the studs are permanently positioned to secure the heating wire while simplifying the overall installation process by eliminating separate securing steps.
2Ease of operation
If a continuous mat is used, then wire positioning is facilitated, but successive adhesive layers cannot interact to form a cohesive bonding system
Solution Approach 1:
The underlayment is segmented into discrete tiles rather than using a continuous mat. This segmentation creates gaps between tiles that allow adhesive to flow through and bond successive flooring layers together, forming a cohesive structural system while still providing stud-based wire positioning on each tile.
Solution Approach 2:
Wire positioning is provided locally through studs on each tile rather than requiring a continuous mat structure. This localized approach to wire securing allows the spaces between tiles to remain open for adhesive interaction, achieving both wire positioning and bonding cohesion.
3Loss of energy
If thick pipes are used for hydronic systems, then heat distribution is effective, but floor thickness increases which may be undesirable
Solution Approach 1:
The system uses thin-film electric heating elements instead of thick hydronic pipes. These thin heating films provide effective heat distribution while maintaining minimal floor thickness, as they can be installed directly on the subfloor without requiring thick pipe installations.
4Length of stationary object
If electric cables are installed directly on subfloor, then installation height is minimized, but wire securing and positioning becomes difficult
Solution Approach 1:
The studs are merged into the underlayment tile structure itself, providing wire securing capability at the same minimal height level. This integration eliminates the need for additional wire securing components that would increase floor buildup height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively secures heating elements, ensures even heating, and facilitates cohesive bonding between flooring layers, reducing thermal loss and installation complexity while allowing for efficient heat distribution and material savings.
Implementation Method 1
In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat
Implementation Method 2
In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat
Data Source
AI summary
An underlayment system is provided that includes a plurality of bosses that emanate from a common base member. The bosses and bases preferably include an opening therethrough that will allow for subsequent layers of adhesive to interact and bond to each other. The bosses are also spaced in such a way to help secure a wire snugly therebetween.