Bottom Cover PCB Layout for Slim Display Thickness

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing display devices face challenges in achieving a slim thickness and elegant exterior design due to the presence of rear covers that house circuit components, which restricts design flexibility and increases thickness.

Innovation Solution

A display device design that incorporates a bending structure for the bottom cover to house circuit components like the source printed circuit board and main board within the inner space, eliminating the rear cover and minimizing protrusions, thereby reducing thickness and enhancing aesthetic appeal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If a rear cover is used to house circuit components, then the components are protected and organized, but the overall thickness increases and the exterior design becomes less elegant

Engineering Contradiction:
Improveexterior design eleganceVSAvoidoverall thickness
Core Design Contradiction:
ShapeVSLength of stationary object

Solution Approach 1:

The patent extracts the circuit components (source printed circuit board and main board) from the traditional rear cover housing and relocates them to the inner space between the display panel and bottom cover. This extraction eliminates the need for a protruding rear cover, thereby reducing overall thickness while maintaining component protection and organization.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the spatial arrangement by positioning circuit components in the depth dimension (inner space) rather than allowing them to protrude in the thickness dimension. The bottom cover is designed with a bending structure that extends along the side surface, creating an L-shaped configuration that accommodates components within the existing thickness envelope, thus reducing overall device thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If circuit components are housed in a rear cover, then components are protected, but design flexibility is restricted

Engineering Contradiction:
Improvedesign flexibilityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the bottom cover structure with the circuit component housing function. The bottom cover is designed with a bending structure that simultaneously serves as the enclosure for the display panel and as the housing for the circuit components. This integration eliminates the separate rear cover, simplifying the overall structure while maintaining protective functionality.

Inventive Principle:
Principle #5Merging (Combining)

3Length of stationary object

If the bottom cover is bent to accommodate circuit components, then thickness is reduced, but manufacturing complexity increases

Engineering Contradiction:
ImprovethicknessVSAvoidmanufacturing ease
Core Design Contradiction:
Length of stationary objectVSEase of manufacture

Solution Approach 1:

The patent applies curvature to the bottom cover by designing it with a bending structure that forms an L-shape. This curved configuration allows the bottom cover to accommodate circuit components in the inner space while maintaining a slim overall thickness. The bending is designed to be manufacturable through standard forming processes.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS20260010028A1Display Device
Publication Date: 2026.01.08 LG DISPLAY CO LTD
  • US20260010028A1 patent drawing
  • US20260010028A1 patent drawing
  • US20260010028A1 patent drawing

AI summary

According to an exemplary of the present disclosure, a display device includes a display panel which displays images and a bottom cover which encloses a rear surface and a side surface of the display panel, and a lower end of the bottom cover extends from a lower end of the display panel to dispose a source printed circuit board in an inner space. By doing this, the entire thickness is reduced to implement a slim design.