Bottom Plate Cleaning via Intermittent Pressure Fluctuations
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Solution Overview
Problem
In the manufacturing of advanced semiconductor components, the corrosive nature of adhesives used for bonding materials poses challenges in removing adhesive residues and oil esters from bonding surfaces, especially as the density of wiring on bottom plates increases and the size of protrusions decreases, making residue removal more difficult and potentially affecting component reliability.
Innovation Solution
A method involving a liquid material covering the bottom plate, placed in a chamber where temperature is controlled between 25-200°C, and subjected to intermittent airflow fluctuations of increasing and reducing pressure, or vacuum pumping, to create a rubbing or stirring effect that enhances cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If commonly used cleaning solvents are used to clean adhesive residues, then cleaning capability is improved, but environmental impact worsens
Solution Approach 1:
The patent changes the physical parameters of the cleaning liquid by controlling temperature (25-200°C) and applying pressure fluctuations (intermittent vacuum or pressurized gas) to enhance the cleaning capability of environmentally friendly liquids, replacing traditional harsh chemical solvents
Solution Approach 2:
The patent applies periodic pressure fluctuations through intermittent vacuum pumping or pressurized gas injection, creating cyclic compression and expansion of the cleaning liquid that enhances its penetrating and lifting forces to remove residues effectively
2Manufacturing precision
If the density of wiring on bottom plate increases or the size of protrusions decreases, then manufacturing precision is improved, but cleaning difficulty worsens
Solution Approach 1:
The patent uses pressurized gas or vacuum to generate fluid dynamic forces that drive the cleaning liquid into narrow gaps and fine wiring structures, enabling effective cleaning of high-precision components with dense wiring and small protrusions that are difficult to access
Solution Approach 2:
The intermittent pressure fluctuations create vibration and agitation in the cleaning liquid, enhancing its ability to penetrate and clean complex geometries including fine wiring and small protrusions through increased liquid motion and cavitation effects
3Productivity
If temperature is elevated to accelerate dissolution, then cleaning efficiency is improved, but energy consumption increases
Solution Approach 1:
The patent uses intermittent pressure fluctuations (vacuum and pressurization cycles) to enhance cleaning efficiency, allowing lower temperature operation compared to continuous high-temperature processes, thereby reducing overall energy consumption while maintaining high productivity
Solution Approach 2:
The pressure fluctuations induce phase transitions in the cleaning liquid (compression and expansion cycles) that enhance mixing and dissolution rates, allowing effective cleaning at lower temperatures and reducing energy requirements for heating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively removes residues from bottom plates by leveraging the fluctuation-induced rubbing action of the liquid material, improving cleaning efficiency and reducing the risk of residue-induced reliability issues in semiconductor components.
Implementation Method 1
generating intermittent pressure increasing and reducing and/or intermittent vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and/or a vacuum generator to generate a wavy airflow
Implementation Method 2
generating intermittent pressure increasing and reducing and/or intermittent vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and/or a vacuum generator
Implementation Method 3
controlling a temperature of the chamber to 25-200° C.
Implementation Method 4
controlling the temperature of the chamber to 25-200° C. in the above-mentioned chamber will also cause the existing oil ester film or some substances to be cleaned or the water vapor adsorbed inside the adjacent bottom plate as above to evaporate and produce gas due to heating
Implementation Method 5
generating intermittent pressure increasing and reducing and/or intermittent vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and/or a vacuum generator to generate a wavy airflow
Implementation Method 6
causing a fluctuation change of the liquid material by controlling a fluctuation change of the gas in the chamber to produce a wave-like fluctuation friction and rubbing cleaning effect
Data Source
AI summary
A method of cleaning a bottom plate, including: providing an adjacent bottom plate with at least one soldering lug, filling a liquid material between the adjacent bottom plate and the soldering lug to cover the substance to be cleaned, and placing the adjacent bottom plate in a chamber, controlling a temperature of the chamber to 25-200° C., generating intermittent pressure increasing and reducing and/or intermittent vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and/or a vacuum generator, causing a fluctuation change of the liquid material using a fluctuation change of the gas, rubbing and scrubbing the liquid material by the fluctuation using the fluctuation change of the gas, and taking the substance to be cleaned attached to the adjacent bottom plate away from the adjacent bottom plate.