Bottom-Side Scribing Device With Optical Alignment
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Solution Overview
Problem
In semiconductor fabrication, existing methods for scribing substrates often damage the top surface features due to the need to contact and align the scribe tool with the fragile top side, and lack practicality for small production or laboratory environments due to complexity and cost.
Innovation Solution
A device and method for scribing the bottom side of a substrate with visual and mechanical aids that allow alignment to top side features without contacting the top side, using a scribing table with orthogonal guides, a diamond scribe tip, and adjustable features for precise positioning and length control, enabling accurate cleaving without damaging the top surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If scribing is performed on the top surface of the substrate, then alignment with circuit features is easier, but the top surface features are damaged
Solution Approach 1:
The patent inverts the conventional scribing approach by scribing the bottom surface instead of the top surface. The scribe tool contacts only the bottom surface while the top surface features remain protected. Alignment is achieved by referencing top surface features visually without physical contact, thus avoiding damage while maintaining alignment accuracy.
2Object-affected harmful factors
If scribing is performed on the bottom side of the substrate, then the top surface features are protected, but alignment with top side features becomes difficult
Solution Approach 1:
The patent introduces an optical intermediary (magnification device such as stereoscope or microscope) that allows the operator to view top surface features while scribing the bottom surface. This intermediary enables accurate alignment reference without direct contact between the scribe tool and top surface features.
3Manufacturing precision
If complex high rate equipment with machine vision and precision alignment is used, then scribing accuracy and productivity are improved, but device complexity and cost increase
Solution Approach 1:
The patent employs simple, inexpensive tools including a basic scribe tool, magnification device (stereoscope or microscope), and ruler or guide. These low-cost components replace complex automated equipment while achieving sufficient accuracy for the application. The system is intentionally simple and can be used in laboratory or small production environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides high accuracy and reliability in scribing and cleaving substrates, suitable for both crystalline and amorphous materials, with minimal expertise and without costly equipment, ensuring precise alignment and reducing damage to top surface features.
Implementation Method 1
a scribing tool that indents the device side
Data Source
AI summary
A device includes a table surface defining a horizontal plane having an x-axis and a y-axis orthogonal to the x-axis and the x-axis and y-axis lie in the horizontal plane; a scribe mounted below the horizontal plane, the scribe further disposed to present at least a portion of the tip above the horizontal plane; a rail arranges parallel to the y-axis and movable in a direction parallel to the x-axis; a sample guide configured in relation to the horizontal plane so that the sample guide arranges parallel to the x-axis and movable in a direction parallel to the y-axis; a scribe stop guide configured in relation to the horizontal plane so that the scribe guide arranges parallel to the x-axis and movable in a direction parallel to the y-axis, whereby the sample guide moves independent of the scribe stop, the scribe stop further comprising a locking mechanism.