Bottom-Source Transistor Charger Thermal Management
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Solution Overview
Problem
Existing chargers face challenges in efficient heat dissipation and electromagnetic interference (EMI) due to the high drain voltage in bottom-drain transistor structures, which require large copper clads for thermal performance but exacerbate EMI issues, complicating circuit design and increasing costs.
Innovation Solution
The charger employs a bottom-source transistor structure with a thermal conductive plate for heat dissipation, where the source terminal, attached to a carrier or heat sink, is closer to the thermal conductive plate than the drain terminal, utilizing a copper clad for enhanced thermal performance while minimizing EMI by reducing the source pulsating voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a bottom-drain transistor structure is used with large copper clad for thermal performance, then heat dissipation is improved, but electromagnetic interference is exacerbated
Solution Approach 1:
The patent inverts the conventional bottom-drain transistor structure to a bottom-source structure. By flipping the transistor orientation so that the source terminal is at the bottom and the drain terminal is at the top, the patent achieves two goals: (1) the source terminal can be directly attached to the thermal conductive plate for efficient heat dissipation, and (2) the drain terminal with high voltage is positioned away from the thermal conductive plate, reducing electromagnetic interference. This inversion resolves the contradiction between heat dissipation performance and EMI control.
2Temperature
If large copper clad is used for thermal performance, then heat dissipation is improved, but circuit design complexity and cost increase
Solution Approach 1:
By inverting the transistor structure to bottom-source configuration, the patent enables the source terminal to be directly mounted on the thermal conductive plate. This eliminates the need for complex thermal management circuitry and large copper clads, as the inverted structure itself provides efficient thermal pathways. The simplification of thermal design directly reduces overall circuit design complexity and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal performance by allowing for a larger heat sink without intensifying EMI, simplifying circuit design and reducing costs by effectively managing heat dissipation and electromagnetic interference.
Implementation Method 1
a thermal conductive plate for heat dissipation... The source terminal is disposed closer to the thermal conductive plate than the drain terminal
Implementation Method 2
the thermal conductive plate includes a copper clad
Data Source
AI summary
A charger includes a thermal conductive plate for heat dissipation, and a transistor. The transistor includes a drain terminal of a first pulsating voltage level, and a source terminal of a second pulsating voltage level. The second pulsating voltage level is lower than the first pulsating voltage level. The source terminal is disposed closer to the thermal conductive plate than the drain terminal.