Boule Grinding Equipment with Multi-Axis Crack Reduction
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Solution Overview
Problem
The existing methods for processing boules in wafer production suffer from cracks during the grinding process, which affects the integrity and efficiency of the manufacturing process.
Innovation Solution
A method involving a grinding equipment with parallel and perpendicular rotational axes for the grinding wheels to minimize cracks, utilizing a movable carrier module and multiple grinding stations to achieve precise and efficient grinding of boule sidewalls and top surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional grinding methods are used on boule, then grinding process can be completed, but cracks occur in the boule during grinding
Solution Approach 1:
The invention applies dynamic rotation configuration where the first grinding wheel rotates along a first rotational axis and the second grinding wheel rotates along a second rotational axis that is perpendicular to the first rotational axis. This dynamic multi-axis rotation system allows the grinding wheels to contact the boule from different orientations, distributing stress more evenly and preventing crack formation during the grinding process.
Solution Approach 2:
The invention introduces a perpendicular rotational axis for the second grinding wheel relative to the first grinding wheel's rotational axis. This dimensional change in the grinding approach allows processing from multiple angular dimensions, reducing concentrated stress on any single plane of the boule and thereby preventing cracks.
2Productivity
If traditional single-grinding-wheel equipment is used, then equipment complexity is low, but processing efficiency of boule is low
Solution Approach 1:
The invention merges multiple grinding functions into a single integrated processing system. The first grinding wheel processes the sidewall of the boule while the second grinding wheel processes the top surface, both within the same equipment framework. This combination of multiple grinding operations in one system significantly improves processing efficiency compared to sequential single-wheel processing.
Solution Approach 2:
The grinding equipment is designed with multi-functionality to perform different grinding operations simultaneously. The first grinding wheel is configured for sidewall grinding while the second grinding wheel is configured for top surface grinding, allowing the equipment to handle multiple aspects of boule processing in one operation, thereby enhancing overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method effectively reduces the occurrence of cracks in boules during grinding, enhancing processing efficiency and wafer quality by using a grinding equipment with specific rotational axis configurations and grinding techniques.
Implementation Method 1
a first grinding wheel located within the first processing station is utilized to perform a sidewall grinding process on a sidewall of the boule
Data Source
AI summary
A processing method for a boule includes the following steps. The boule is moved to a first processing station of a grinding equipment, and a first grinding wheel located within the first processing station is utilized to perform a sidewall grinding process on a sidewall of the boule. During the sidewall grinding process, the boule rotates along a first rotational axis, and the first grinding wheel rotates along a second rotational axis, wherein the first rotational axis is parallel to the second rotational axis. The boule is moved to a second processing station of the grinding equipment, and a second grinding wheel located within the second processing station is utilized to perform a top surface grinding process on a top surface of the boule.