Bowed Base Plate Thermal Interface for Semiconductor Heat Dissipation
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Solution Overview
Problem
Semiconductor devices with bowed mounting surfaces face challenges in heat dissipation due to gaps formed between the semiconductor device and the cooling body, leading to deteriorated heat dissipation properties.
Innovation Solution
A semiconductor device design featuring a base plate with a bowed rear surface where contact materials are discretely arranged, with increased volume at concave areas to bridge the gap between the base plate and the cooling body, ensuring effective heat dissipation by optimizing the volume and distribution of thermal interface materials based on the bowed shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling body is attached to a semiconductor device with a bowed mounting surface, then heat dissipation is required, but gaps are formed between the semiconductor device and cooling body leading to deteriorated heat dissipation properties
Solution Approach 1:
The contact material is configured with non-uniform thickness where the thickness at the concave portion is greater than at other portions. This local variation in quality ensures complete gap filling at the deepest point while maintaining adequate contact elsewhere, resolving the contradiction between achieving continuous heat dissipation path and accommodating the bowed surface geometry
Solution Approach 2:
The invention changes the geometric parameter of the contact material from uniform thickness to variable thickness, specifically increasing thickness at the concave portion. This parameter change allows the contact material to adapt to the bowed surface shape, ensuring complete gap filling and continuous heat dissipation path while maintaining reliability
2Reliability
If contact material is used to bridge gaps on a bowed surface, then heat dissipation path is established, but conventional uniform contact material cannot fill deep concaves effectively
Solution Approach 1:
The contact material features locally varied thickness with maximum thickness positioned at the concave portion of the bowed surface. This local quality enhancement ensures that the deepest gaps are completely filled while maintaining adequate contact material presence elsewhere, thereby ensuring both reliable gap filling and effective heat dissipation
Solution Approach 2:
The contact material is pre-configured with non-uniform thickness before attachment, with the thicker portion strategically positioned at the concave area. This preliminary action ensures that when the cooling body is attached, the gap at the concave portion is automatically and effectively filled without requiring additional adjustment or material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures appropriate heat dissipation properties even with bowed mounting surfaces, eliminating gaps and enhancing thermal conductivity between the semiconductor device and the cooling body.
Implementation Method 1
a heat dissipation path from the semiconductor device to the cooling body is thereby secured
Data Source
AI summary
A semiconductor device includes a semiconductor element, a base plate, and a plurality of contact materials. The base plate has a front surface holding the semiconductor element and a rear surface to which a cooling body to cool the semiconductor element is attachable. The plurality of contact materials are discretely arranged on the rear surface of the base plate. The plurality of contact materials are materials for bridging a gap on a heat dissipation path between the base plate and the cooling body. The plurality of contact materials each have a volume based on a bowed shape of the rear surface of the base plate. From among the plurality of contact materials, a contact material at a concave of the bowed shape has a greater volume than a contact material at a convex of the bowed shape.