Box Chassis Heat Dissipation System Preventing Condensation
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Solution Overview
Problem
Communication devices with box type chassis face corrosion issues due to high humidity and dust, leading to potential service disruptions and increased maintenance costs, as existing heat dissipation methods like conformal coatings have limited effectiveness and are costly, while air cooling can cause vapor condensation and further corrosion.
Innovation Solution
A heat dissipation system with an upper and lower heat dissipation channel, featuring air exhaust and intake vents on the sidewalls of the box type chassis, where the airflow direction is designed to prevent vapor condensation by ensuring the temperature rise at air vents prevents water film formation, using fans and air baffles to circulate hot air effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conformal coating is applied to protect circuit boards from corrosion, then corrosion resistance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the harmful moisture and vapor from the internal environment by introducing a heating element that generates hot air flow. This hot air circulates through the device interior, actively removing moisture that could cause corrosion, thereby eliminating the need for conformal coating protection while maintaining corrosion resistance
Solution Approach 2:
The patent replaces the chemical protection method (conformal coating) with a physical method (thermal field). By using a heating element to generate hot air flow that circulates through the device, moisture is evaporated and removed, providing corrosion protection without requiring additional coating materials or complex spraying processes
2Duration of action of stationary object
If conformal coating is applied to protect circuit boards, then service life is extended, but manufacturing cost increases
Solution Approach 1:
The heating element utilizes waste heat from the communication device's operation to maintain internal temperature and prevent condensation. The device's own operational heat serves the dual purpose of both cooling electronics and preventing moisture accumulation, eliminating the need for expensive protective coatings while extending service life
Solution Approach 2:
The patent replaces expensive chemical conformal coating materials and multi-step application processes with a simple heating element and air circulation system. This physical approach provides equivalent or superior protection against corrosion and condensation at a fraction of the manufacturing cost
3Temperature
If air cooling is used for heat dissipation, then heat dissipation efficiency is improved, but vapor condensation and corrosion risk increase
Solution Approach 1:
The patent applies different temperature characteristics to different regions: cold air is directed toward heat-generating components for cooling, while hot air is directed toward areas prone to condensation to prevent moisture accumulation. This localized thermal management simultaneously achieves effective heat dissipation and condensation prevention
Solution Approach 2:
The patent creates a composite thermal environment within the device by combining cold and hot air flows. The heating element generates hot air that mixes with the cooling air from fans, creating zones of different temperatures that prevent condensation on cold surfaces while maintaining effective heat dissipation from hot components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively prevents condensation on circuit boards, reducing corrosion risks and enhancing the reliability and service life of communication devices, while being cost-effective and suitable for adverse environments.
Implementation Method 1
a heating element, wherein the heating element is arranged in the box type chassis and used for heating air in the box type chassis
Implementation Method 2
a fan, wherein the fan is arranged in the box type chassis and used for driving air circulation within the box type chassis
Data Source
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AI summary
The present invention relates to a heat dissipation system for a communication device with a box type chassis, a box type chassis, and a communication device with a box type chassis. The heat dissipation system includes an upper heat dissipation channel and a lower heat dissipation channel, where the upper heat dissipation channel and the lower heat dissipation channel both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film, occurrence of condensation or water film is prevented, and the circuit board is protected against corrosion caused by condensation.