Bracket Assembly Spring Module Grounding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Metal brackets in mobile devices interfere with electromagnetic signals due to their conductive nature, affecting communication performance.
Innovation Solution
A bracket assembly that incorporates a spring module with a metal bracket, where the spring module provides a restoring force to ensure the metal bracket is grounded, reducing electromagnetic interference by distributing the grounding contact points symmetrically around the metal bracket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a metal bracket is used to support electronic components, then structural stability and precise positioning are improved, but electromagnetic interference with communication signals increases
Solution Approach 1:
A non-conductive coating layer is applied on the surface of the metal bracket to act as an intermediary between the conductive metal and the electromagnetic signals. This coating layer blocks the electromagnetic interference while the metal bracket maintains its structural support function underneath.
Solution Approach 2:
The bracket is constructed as a composite structure combining metal material for mechanical strength with a non-conductive coating material for electromagnetic shielding. This composite design allows simultaneous achievement of structural stability and reduced electromagnetic interference.
2Stability of the object's composition
If a metal bracket is used to support electronic components, then structural stability is improved, but communication performance deteriorates
Solution Approach 1:
The non-conductive coating serves as a mediator that allows the metal bracket to provide structural support while preventing direct interaction between the metal surface and electromagnetic communication signals, thereby protecting signal integrity.
Solution Approach 2:
The composite structure of metal substrate with non-conductive coating enables the bracket to simultaneously provide mechanical stability and electromagnetic compatibility, ensuring reliable communication performance.
3Object-affected harmful factors
If grounding contact points are distributed symmetrically around the metal bracket, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The non-conductive coating is applied uniformly across the entire surface of the metal bracket, creating continuous electromagnetic protection without requiring additional grounding contact points or complex grounding structures. The coating itself serves the shielding function throughout.
Solution Approach 2:
The uniform non-conductive coating simplifies the overall design by providing electromagnetic interference reduction through material selection rather than through complex geometric arrangements of grounding elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, enhances structural stability, and improves user experience by ensuring stable communication performance while maintaining precise positioning and easy assembly of electronic components.
Implementation Method 1
the spring module comprises a pressing portion 201, an elastic portion 202, and a fixing portion 204... The elastic portion 202 connects the pressing portion 201, and the pressing portion 201 and the elastic portion 202 can be an integrated structure... The elastic portion 202 connects the pressing portion 201 and the fixing portion 204, and provides a restoring force to the pressing portion 201
Implementation Method 2
the metal bracket 10 is configured to support an electronic component... the metal bracket 10 can be electrically connected to the ground without changing the mounting structure of the metal bracket 10... the metal bracket 10 is grounded through the spring module 20
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present disclosure relates to a bracket assembly (1000) is provided. The bracket assembly (1000) includes a metal bracket (10) and a spring module (20). The metal bracket (10) is configured to support an electronic component in a mobile terminal (2000). The spring module (20) includes a fixing portion (204), a pressing portion (201), and a elastic portion (202); the fixing portion (204) is fixed in the mobile terminal (2000) and grounded, and the elastic portion (202) connects the pressing portion (201) and the fixing portion (204); the elastic portion (202) is configured to provide a restoring force to the pressing portion (201), and press the pressing portion (201) to be in contact with the metal bracket (10). A camera module (100) and a mobile terminal (2000) are also provided.