Bracket Vapor Chamber Layout for Compact PCB Heat Dissipation
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Solution Overview
Problem
Downsized electronic devices generate heat during operation, necessitating an effective heat dissipation structure to maintain functionality and performance.
Innovation Solution
The electronic device incorporates a bracket with a vapor chamber and a shield can structure, including a heat conduction member and a shielding sheet, to efficiently dissipate heat generated by components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are disposed in a downsized electronic device, then the device size is reduced and portability is improved, but heat generated by the components becomes difficult to dissipate effectively
Solution Approach 1:
The vapor chamber is nested within the bracket structure, utilizing the existing space efficiently. The first portion of the vapor chamber is disposed above the heat generating component, the second portion is interposed between the mounting portion and the battery, and the third portion extends from the first to the second portion, creating a compact nested arrangement that maximizes heat dissipation surface area within the limited device volume.
Solution Approach 2:
The vapor chamber extends in multiple spatial dimensions to maximize heat dissipation coverage. The third portion extends from the first portion to the second portion, creating a three-dimensional heat dissipation pathway that utilizes vertical and lateral space effectively, transforming a two-dimensional heat dissipation problem into a three-dimensional solution.
2Temperature
If a vapor chamber is added to the bracket for heat dissipation, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The vapor chamber is integrated with the bracket structure, merging two functional components into a unified assembly. The bracket serves both as a mounting structure for electronic components and as a housing for the vapor chamber, eliminating the need for separate heat dissipation structures and reducing overall assembly complexity.
Solution Approach 2:
The bracket performs multiple functions: it provides structural support for the electronic components, houses the vapor chamber for heat dissipation, and serves as a mounting structure for the battery. This multi-functionality reduces the number of separate components needed and simplifies the overall device architecture.
3Temperature
If the battery is spaced apart from the heat generating component, then heat dissipation is improved, but the space utilization in the device is reduced
Solution Approach 1:
The second portion of the vapor chamber is interposed between the mounting portion and the battery, creating a nested arrangement where the vapor chamber occupies the space between the bracket and battery. This allows the battery to be positioned closer to the heat generating component while still maintaining effective heat dissipation through the vapor chamber medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, ensuring the device operates efficiently and maintains performance by reducing thermal buildup.
Implementation Method 1
a vapor chamber on the mounting portion of the bracket. The vapor chamber may include a first portion disposed above the heat generating component, a second portion interposed between the mounting portion and the battery, and a third portion extending from the first portion to the second portion
Data Source
AI summary
An electronic device may include: a bracket including a mounting portion; a printed circuit board (PCB) overlapping with the bracket; a heat generating component on a surface of the PCB, the surface of the PCB facing the bracket; a battery spaced apart from the heat generating component, the battery being in the bracket; and a vapor chamber on the mounting portion of the bracket, wherein the vapor chamber includes: a first portion above the heat generating component, a second portion between the mounting portion and the battery, and a third portion extending from the first portion of the vapor chamber to the second portion of the vapor chamber.