Brake Control Heat Sink Layout for Consistent Thermal Interface
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Solution Overview
Problem
The existing electronic devices face challenges in maintaining effective heat dissipation performance due to the need for screw holes and seat surfaces, which can lead to variations in the thickness of heat dissipating materials, impairing the ability to position the heat sink close to the electronic component and affecting thermal management.
Innovation Solution
An electronic control apparatus with a heat sink that includes a distal-side abutment portion away from the electronic component and a proximal-side abutment portion closer to the board, allowing for improved heat dissipation without the need for screw fixation, ensuring the heat sink is positioned optimally relative to the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is fixed to the heat sink using screw members, then the heat sink can be securely mounted, but holes and seat surfaces must be provided which prevents the abutment portion from being positioned close to the electronic component
Solution Approach 1:
The invention extracts the fastening function from the abutment portion by providing a separate fastening portion on the heat sink. The abutment portion can now be positioned close to the electronic component without needing to accommodate screw holes or seat surfaces, as the fastening function is handled by the dedicated fastening portion with through-holes.
Solution Approach 2:
The heat sink is segmented into distinct functional portions: an abutment portion for thermal contact with the electronic component and a fastening portion for mechanical attachment to the substrate. This segmentation allows each portion to be optimized independently - the abutment portion can be positioned optimally for heat dissipation while the fastening portion handles mounting requirements.
2Ease of manufacture
If the abutment portion is positioned away from the electronic component, then screw fixation is easier, but the thickness of heat dissipating material varies which impairs heat dissipation performance
Solution Approach 1:
The invention extracts the fastening function from the abutment portion, allowing the abutment portion to focus solely on thermal contact. The fastening portion with its through-holes handles all mounting requirements, enabling the abutment portion to maintain consistent, minimal thickness of heat dissipating material without compromising assembly ease.
Solution Approach 2:
The fastening portion acts as an intermediary that mediates between the mounting requirements (screw fixation) and the thermal contact requirements (consistent heat dissipating material thickness). By providing a dedicated fastening interface, it allows the abutment portion to maintain optimal thermal contact without the complications of integrated fastening features.
3Strength
If screw holes and seat surfaces are provided on the heat sink, then the heat sink can be firmly fixed to the substrate, but the abutment portion cannot be positioned close to the electronic component
Solution Approach 1:
The heat sink is divided into an abutment portion for thermal contact and a fastening portion for mechanical attachment. This segmentation allows the fastening portion to be positioned optimally for strong screw fixation while the abutment portion can be positioned as close as possible to the electronic component for effective heat dissipation.
Solution Approach 2:
The fastening function is extracted from the abutment portion and placed in a dedicated fastening portion. This allows the abutment portion to achieve minimal distance from the electronic component while the fastening portion provides the necessary fixation strength through its through-holes and screw member engagement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency by maintaining a consistent thickness of heat dissipation material, reducing temperature increases in heat-generating components and facilitating precise assembly without the need for screw holes or seat surfaces.
Implementation Method 1
a heat sink provided with a heat dissipation material interposed between the heat sink and the electronic component
Data Source
AI summary
An electronic control apparatus includes a control board, a heat-generating electronic component mounted on the control board, and a heat sink provided with a heat dissipation material interposed between the heat sink and the heat-generating electronic component. The heat sink includes at least a distal-side abutment portion in abutment with the control board at a position away from the heat-generating electronic component, and first and second proximal-side abutment portions in abutment with the control board without being fixed to the control board at positions away from the heat-generating electronic component by distances shorter than a distance between the heat-generating electronic component and the distal-side abutment portion. Due to that, the impairment of the heat dissipation performance can be reduced.