Brake Heating Element Heat Sink Structure for Direct Heat Transfer
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Solution Overview
Problem
Existing heat dissipation methods for brake system inverter circuits, which utilize thermal grease and vias on PCBs, suffer from poor heat dissipation efficiency due to heat being radiated through the substrate.
Innovation Solution
A heat dissipation structure that directly transfers heat from a heating element to a heat sink via a heat transfer material, such as thermal grease, without passing through the PCB substrate, and incorporates a heat sink as part of the housing to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat dissipation is performed through vias on PCB substrate, then heat can be radiated to heat sink structure, but heat dissipation efficiency is poor
Solution Approach 1:
The patent extracts the heating element from the PCB substrate and mounts it directly on the heat sink structure. This separation eliminates the need for heat to travel through the PCB substrate and vias, directly addressing the poor heat dissipation efficiency caused by the substrate's thermal resistance.
Solution Approach 2:
The patent segments the heat dissipation path into distinct components: the heating element, the heat transfer material, and the heat sink structure. This segmentation allows each component to be optimized for its specific function, with the heat sink structure being specifically designed for efficient heat dissipation.
2Loss of energy
If heating element is mounted on PCB with thermal grease and vias, then heat can be transferred to heat sink, but heat dissipation efficiency is reduced due to substrate interference
Solution Approach 1:
The heating element is extracted from the conventional PCB mounting approach and directly coupled to the heat sink structure. This eliminates the PCB substrate from the heat transfer path, removing the thermal resistance introduced by the substrate and via structures.
Solution Approach 2:
The patent merges the mounting function and heat dissipation function into a single integrated structure. The heat sink structure serves both as the mounting platform for the heating element and as the primary heat dissipation component, eliminating the need for separate PCB substrate and via structures.
3Loss of energy
If heat dissipation is performed through PCB substrate, then heat can reach heat sink structure, but heat dissipation efficiency is poor due to substrate thermal resistance
Solution Approach 1:
The mounting structure and heat sink structure are merged into a single integrated component. This eliminates the need for separate PCB substrate, vias, and heat sink assembly, simplifying the manufacturing process while simultaneously improving heat dissipation efficiency by removing thermal resistance at each interface.
Solution Approach 2:
The PCB substrate is extracted from the heat dissipation path and replaced with a direct mounting structure on the heat sink. This extraction eliminates the thermal resistance introduced by the substrate and via structures, directly improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases heat dissipation efficiency by directly transferring heat from the heating element to the heat sink, simplifying the structure and improving mass productivity.
Implementation Method 1
a heat transfer material comprising a first region portion interposed between the other surface of the heating element and one surface of the heat sink
Data Source
AI summary
A heat dissipation structure is provided. The heat dissipation structure according to an aspect of the present disclosure includes a PCB substrate having a first heat dissipation pad having a predetermined area on one surface; a heating element coupled onto the heat dissipation pad by a coupling part, the heating element having one surface disposed adjacent to the heat dissipation pad and the other surface opposite to the one surface; a heat sink having one surface disposed of contact on the heating element; and a heat transfer material comprising a first region portion interposed between the other surface of the heating element and one surface of the heat sink.