Brake Pad PCB Stiffening for Accurate Force Sensor Readings
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Solution Overview
Problem
Existing sensor-equipped brake pads with printed circuit boards (PCBs) face issues with adherence to the rear plate, leading to pressure force signal inversion and potential moisture ingress, which affects the accuracy and reliability of sensor readings.
Innovation Solution
The integration of structural stiffening means, such as a filler material or discrete elements, between the printed circuit board and the rear support plate, ensures rigid connection and prevents strain under load, thereby enhancing adherence and resistance to deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the PCB is fixed to the rear plate using traditional welding or mechanical riveting points along the perimeter, then the board can be secured in place, but complete adherence is not achieved, causing pressure force signal inversion and potential moisture ingress
Solution Approach 1:
The patent combines multiple fixing methods (welding, mechanical riveting, and adhesive bonding) into a hybrid fixation system. The adhesive layer fills the gap between the PCB and rear plate, working in conjunction with welding or riveting points to achieve complete adherence and eliminate the partial adhesion problems of traditional methods
Solution Approach 2:
An adhesive layer is introduced as an intermediary substance between the PCB and the rear plate. This adhesive mediator fills the gap and creates a continuous bonding interface, ensuring complete adherence and preventing moisture ingress while accurately transmitting mechanical stresses to the sensors
2Ease of manufacture
If the support structure is not sufficiently rigid, then the assembly is easier to manufacture, but compressive stress induces strain in the piezoelectric sensor, causing signal inversion
Solution Approach 1:
The patent modifies the mechanical parameters of the support structure by adding stiffening elements or increasing the thickness/rigidity of the rear plate in specific areas. This changes the structural parameters to provide sufficient rigidity that prevents strain induction in the piezoelectric sensors under compressive stress, while maintaining manufacturability through standardized design features
3Productivity
If the gap between the board and the rear plate is left open, then the assembly process is simpler, but moisture, dust and dirt can enter the gap, nullifying the efficiency and safety of the measurements
Solution Approach 1:
The adhesive layer serves as an intermediary that fills and seals the gap between the PCB and rear plate during assembly. This eliminates the open gap that would allow moisture and contaminant ingress, while the adhesive application process is simple and does not significantly impact assembly productivity
Solution Approach 2:
The adhesive layer acts as a thin film barrier that seals the interface between the PCB and rear plate. This thin film prevents moisture, dust, and contaminant penetration while maintaining the structural integrity and electrical functionality of the assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures complete adherence of the PCB to the rear plate, maintains the accuracy of sensor readings, and enhances the resistance to deformation under operating stresses, thereby improving the reliability and efficiency of the brake pad system.
Implementation Method 1
which are equipped with sensors, typically force sensors, by means of piezoelectric and temperature elements
Data Source
Figure 1~2
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Figure 5~7
AI summary
A sensor-equipped brake pad (1) for the braking system of a motor vehicle, comprising a printed circuit board (200), a rear support plate (100) having a recess (110) in which the printed circuit board (200) is fixed, at least one force sensor (201) mounted on the printed circuit board (200), a block of friction material (300) mounted on the rear plate (100), wherein the printed circuit board (200) is interposed between the rear plate (100) and the block of friction material (300), and wherein structural stiffening means (260) for the printed circuit board (200) are provided.