Branch Conductive Layer Layout for Moisture-Resistant Bonding Pads
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Solution Overview
Problem
The challenge in developing electronic devices with narrow bezel designs is the vulnerability of flexible circuit boards to moisture and air ingress, leading to oxidation and corrosion of metal components, which causes short circuits and device deterioration.
Innovation Solution
An electronic device design featuring a conductive layer with branch portions and bonding pads, along with an insulating layer between the conductive layer and the bonding pads, to enhance electrical connectivity and protect against moisture and air exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a flexible circuit board is used to connect the electronic device with external power source or signal source, then the device can achieve narrow bezel design, but moisture or air easily enters from the joint between the flexible circuit board and the electronic device, causing oxidation or corrosion of the metal inside the electronic device
Solution Approach 1:
The conductive layer is divided into multiple branch portions that extend in different directions, with each branch having bonding pads at its end. This segmentation allows for distributed connection points along the conductive layer, enabling flexible routing while maintaining structural integrity and reducing stress concentration at any single point.
Solution Approach 2:
An insulating layer is introduced as an intermediary between the conductive layer and the bonding pads. This insulating layer prevents direct contact between the conductive layer and external moisture or air that may be present at the bonding pad interfaces, thereby protecting the metal conductors from oxidation and corrosion while still allowing electrical connection through the bonding pads.
2Reliability
If bonding pads are directly connected to the conductive layer, then electrical connectivity is achieved, but the conductive layer is vulnerable to moisture and air ingress causing short circuit or deterioration
Solution Approach 1:
The insulating layer serves as a protective intermediary positioned between the conductive layer and the bonding pads. It allows electrical signals to be transmitted through the bonding pads while preventing harmful substances like moisture and air from directly contacting and corroding the conductive layer, thus eliminating the need for additional protective structures.
Solution Approach 2:
The insulating layer creates a protected environment around the conductive layer, effectively isolating it from the external atmosphere that contains moisture and oxygen. This isolation prevents oxidation and corrosion reactions that would otherwise occur at the bonding pad interfaces, ensuring long-term reliability of the electrical connections.
Data Source
AI summary
An electronic device includes: a substrate; a conductive layer disposed on the substrate, wherein the conductive layer includes a plurality of branch portions; a plurality of bonding pads respectively disposed on the plurality of branch portions of the conductive layer; and an insulating layer disposed between the conductive layer and the plurality of bonding pads.