Branch Electrode Terminal Structure for Better Semiconductor Bonding
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Solution Overview
Problem
Insufficient heat conduction between a metal pattern and an electrode terminal during bonding in semiconductor devices leads to poor bonding due to inadequate temperature rise, resulting in unfavorable bonding quality.
Innovation Solution
The semiconductor device design includes a metal pattern and an electrode terminal with branching portions, where the narrow branch portion is bonded with thinner bonding material closer to the metal pattern, ensuring effective heat conduction and reducing temperature differences between the electrode terminal and the metal pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a gap is formed between the metal pattern and the electrode terminal during bonding, then the bonding process becomes easier to perform, but heat conduction between the metal pattern and the electrode terminal becomes insufficient, resulting in poor bonding quality
Solution Approach 1:
The electrode terminal is designed with varying width along its length, creating different local geometries. The wider portion ensures sufficient heat conduction when bonded to the metal pattern, while the narrower portion maintains ease of bonding. This local variation in geometry allows the same component to satisfy both contradictory requirements at different locations.
2Reliability
If the bonding material thickness is increased to improve bonding quality, then bonding reliability improves, but heat conduction between the metal pattern and electrode terminal deteriorates due to insufficient temperature rise
Solution Approach 1:
The bonding material thickness is varied locally according to the width of the electrode terminal. At the wider portion where heat conduction is critical, the bonding material is made thinner to maintain thermal contact and temperature rise. At other portions where bonding reliability is prioritized, the bonding material can be thicker. This local differentiation resolves the contradiction between bonding quality and temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat conduction and reduces the likelihood of insufficient temperature rise, thereby improving bonding quality and suppressing poor bonding between the metal pattern and the electrode terminal.
Implementation Method 1
a gap formed between the metal pattern and the electrode terminal can cause insufficient heat conduction between the metal pattern and the electrode terminal
Data Source
AI summary
An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.