Branched Heat Pipe Cooling Module for Lower-Cost Dual Heat Sinks
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Solution Overview
Problem
Existing cooling modules using two heat pipes for heat transport in electronic devices are costly and labor-intensive to assemble, despite achieving high cooling performance.
Innovation Solution
A cooling module design that utilizes a single heat pipe with branched pipe portions connecting to both heat sinks, reducing component and assembly costs while maintaining high efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If two heat pipes are used to transport heat to left and right heat sinks, then cooling performance is improved, but component cost and assembly work cost increase
Solution Approach 1:
The patent merges two separate heat pipes into a single heat pipe with branched pipe portions. The first heat pipe includes a first pipe portion connected to the heating element, a second pipe portion branched from the first pipe portion and connected to the first heat sink, and a third pipe portion branched from the first pipe portion and connected to the second heat sink. This integration maintains the cooling performance of transporting heat to both heat sinks while reducing component count and assembly complexity
Solution Approach 2:
The single heat pipe is segmented into multiple functional portions (first pipe portion, second pipe portion, third pipe portion) that can be independently connected to different components. This segmentation allows the heat pipe to serve multiple cooling zones while remaining a single integrated component, resolving the contradiction between comprehensive heat transport and assembly simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The single heat pipe configuration ensures high cooling performance while lowering costs and simplifying assembly, thereby enhancing the cost-effectiveness of the cooling module and the electronic apparatus.
Implementation Method 1
a heat pipe configured to transport heat from the heating element to the first heat sink and the second heat sink
Implementation Method 2
the heat pipe includes a first pipe portion for connecting to the heating element, a second pipe portion branched from one end part of the first pipe portion and connected to the first heat sink, and a third pipe portion branched from the one end part of the first pipe portion and connected to the second heat sink
Implementation Method 3
a first fan having an outlet, a second fan having an outlet, a first heat sink disposed to face the outlet of the first fan
Implementation Method 4
a second fan having an outlet, a first heat sink disposed to face the outlet of the first fan, a second heat sink disposed to face the outlet of the second fan
Data Source
AI summary
A cooling module that is mounted in an electronic apparatus including a heating element includes a first fan having an outlet, a second fan having an outlet, a first heat sink disposed to face the outlet of the first fan, a second heat sink disposed to face the outlet of the second fan, and a heat pipe configured to transport heat from the heating element to the first heat sink and the second heat sink, in which the heat pipe includes a first pipe portion for connecting to the heating element, a second pipe portion branched from one end part of the first pipe portion and connected to the first heat sink, and a third pipe portion branched from the one end part of the first pipe portion and connected to the second heat sink.