Branched Organopolysiloxane Composition for Alkali-Soluble Beam Patterning

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Solution Overview

Problem

Existing curable organopolysiloxanes lack sufficient alkali solubility and high energy beam curability, limiting their effectiveness in high-precision patterning and insulating applications for electronic devices.

Innovation Solution

A phenolic hydroxyl group-containing branched organopolysiloxane with a specific structure that exhibits high solubility in alkaline aqueous solutions and excellent high energy beam curability, forming a curable composition that can be easily patterned and used as a resist material or insulating material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If linear polysiloxane components are used to achieve curability, then high energy beam curability is improved, but alkali solubility deteriorates

Engineering Contradiction:
Improvehigh energy beam curabilityVSAvoidalkali solubility
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent uses a composite structure combining phenolic hydroxyl groups with organopolysiloxane backbone. The phenolic hydroxyl groups provide alkali solubility through their chemical structure, while the organopolysiloxane provides the curable framework. This composite approach allows both alkali solubility and high energy beam curability to coexist without compromising either property.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical parameters of the polysiloxane by introducing specific phenolic hydroxyl group configurations and controlling the ratio of different functional groups. By adjusting these chemical parameters, the material achieves optimal balance between alkali solubility and curability, resolving the contradiction between these two properties.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If phenol-functional polysiloxanes are used to improve alkali solubility, then solubility in alkaline solutions is improved, but high energy beam curability deteriorates

Engineering Contradiction:
Improvealkali solubilityVSAvoidhigh energy beam curability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent creates a composite material where phenolic hydroxyl groups are integrated into the organopolysiloxane structure. This composite design ensures that the phenolic groups provide alkali solubility while the polysiloxane framework maintains curability through its inherent chemical structure and reactivity with high energy beams.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the chemical composition by controlling the density and arrangement of phenolic hydroxyl groups within the polysiloxane chain. By carefully adjusting these chemical parameters, the material achieves sufficient alkali solubility while preserving the curability needed for high energy beam processing.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If conventional resist materials are used to achieve patterning, then manufacturing precision is improved, but adaptability to high energy beam curing deteriorates

Engineering Contradiction:
Improvepatterning precisionVSAvoidhigh energy beam curability
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent modifies the chemical parameters of the resist material by incorporating phenolic hydroxyl groups into the organopolysiloxane structure. This chemical modification enables the material to respond to high energy beam irradiation while maintaining the patterning precision required for advanced manufacturing applications.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a multi-functional material that serves both as a resist for high-precision patterning and as a curable composition for high energy beam processing. The phenolic hydroxyl-containing organopolysiloxane structure provides both the solubility contrast needed for patterning and the reactivity needed for beam-induced curing, achieving universal applicability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The curable composition enables high-precision patterning with easy removal of unreacted materials and provides a transparent, mechanically strong insulating layer suitable for electronic devices, particularly thin displays like OLEDs.

Implementation Method 1

a phenolic hydroxyl group-containing branched organopolysiloxane which can be cured by actinic rays, for example high energy beams or electron beams

Methodology Applied
Scientific EffectHigh energy beam absorption: Absorption (EM radiation)

Data Source

PatentUS20260050218A1Phenolic hydroxyl group-containing branched organopolysiloxane, high energy ray-curable composition containing same, and use thereof
Publication Date: 2026.02.19 DOW TORAY CO LTD
  • US20260050218A1 patent drawing
  • US20260050218A1 patent drawing
  • US20260050218A1 patent drawing

AI summary

Provided is a curable reactive organopolysiloxane having favorable alkali solubility and a high energy beam-curable composition containing the same. Specifically, provided is a phenolic hydroxyl group-containing branched organopolysiloxane expressed by the following average unit formula (1): (A3SiO1/2)a(A2SiO2/2)b(RSiO3/2)c(SiO4/2)d. In formula (1), R is a monovalent hydrocarbon group or the like; A is group selected from the same groups as R and group M1 is expressed by formula (21) described herein, where in formula (21), R1 is a divalent hydrocarbon group having 2 to 6 carbon atoms, X is a hydroxyl group, Z is a monovalent group expressed by —OR3 (where R3 is an acid-dissociable group), m1 is 1 to 3, and k is 0 to 3. At least one of all A is M1, and a, b, c, and d satisfy the following conditions: 0≤a, 0≤b, 0<(a+b), and 0<(c+d).