Branchline Coupler Phase Shifter with Additive Conductive Segments
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Solution Overview
Problem
Existing analog phase shifters using branchline couplers face limitations in fine-tuning phase adjustments, particularly at microwave frequencies, due to the coarse granularity of wire bond solutions which restrict precise phase control.
Innovation Solution
The method involves using additive manufacturing to deposit conductive layer segments between conductive pads on a substrate, connected to the ground plane, allowing for precise phase tuning by measuring and adjusting the length of these segments until a predetermined phase shift is achieved, thereby enhancing the phase shifting capability of branchline couplers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wire bond methods are used to adjust phase shift in branchline coupler, then the phase shifter can be manufactured, but the phase tuning granularity is coarse (5-7 degrees) and precision is limited
Solution Approach 1:
The phase adjusting section is divided into multiple discrete conductive layer segments that can be selectively deposited between conductive pads. Each segment adds a specific phase shift increment, enabling fine-grained phase control. The segments are arranged in a sequence where any combination can be activated to achieve the desired phase shift with granularity down to 0.5 degrees.
Solution Approach 2:
The invention transitions from one-dimensional wire bond adjustments to two-dimensional conductive layer segments deposited on the substrate surface. The segments are positioned between conductive pads in a planar configuration, allowing precise phase control through selective deposition in the lateral dimension rather than through vertical wire bond length adjustments.
2Measurement precision
If conductive layer segments are deposited to achieve fine phase tuning, then phase control precision improves to 0.5 degrees, but the manufacturing process complexity increases
Solution Approach 1:
The mechanical wire bond cutting and reconfiguration process is replaced with a deposition-based manufacturing approach. Conductive layers are deposited using standard semiconductor fabrication techniques, and the desired phase shift is achieved by selectively forming conductive paths through the deposited layers, eliminating the need for mechanical wire manipulation.
Solution Approach 2:
The phase shift characteristic is controlled by changing the geometric parameters of the conductive layer segments, specifically their length and position between conductive pads. By adjusting these physical dimensions during deposition, precise phase control is achieved without changing the fundamental structure or material properties of the branchline coupler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a higher degree of granularity in phase tuning, enabling more precise control over phase shifts, with segment lengths as short as 2 mils creating 0.5 degrees of phase shift at upper C-Band frequencies, compared to the 5-7 degrees achieved by traditional wire bond methods.
Implementation Method 1
The method includes sequentially depositing a series of conductive layer segments on the upper surface of the substrate in the gap electrically connected to sidewalls of the first conductive pad and the second conductive pad
Data Source
AI summary
A phase shifter is formed by providing a branchline coupler having a pair of phase adjusting sections. Each one of the phase adjusting sections is coupled to a corresponding one of a pair of shunt transmission line sections of the branchline coupler. Each one of the pair of phase adjusting sections includes: first and second conductive pads are disposed on the surface of a substrate having a gap between them; one of the pads being connected to a ground plane conductor on a bottom surface of the substrate. A series of conductive layer segment is sequentially written on the surface of the substrate in the gap electrically connected to sidewalls of the first and second pads. Phase shift through the phase shifter is measured after each one of the segments is written. The writing process is terminated when the measuring detects a predetermined phase shift through the phase shifter.