Brazing Ceramic Semiconductor Components for Repair
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Solution Overview
Problem
Current methods for manufacturing semiconductor processing equipment using ceramics are costly, time-consuming, and lack repair options, as they require high temperatures, high pressures, and complex setups, making it difficult to join and disassemble components without compromising hermeticity and mechanical integrity.
Innovation Solution
A brazing method is used to join ceramic pieces, employing a metal binder like aluminum, which forms a hermetic seal at lower temperatures and pressures, allowing for the separation of components for repair and reuse, using a braze filler material that withstands harsh processing environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hot pressing and sintering methods are used to manufacture ceramic components, then mechanical integrity and hermeticity are achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The ceramic component is divided into multiple green ceramic sub-components that are manufactured separately using injection molding or compression molding, then joined together through brazing. This segmentation allows each sub-component to be produced independently with simpler equipment and processes, avoiding the need for complex hot pressing and sintering of large integrated pieces.
Solution Approach 2:
A braze filler material is introduced as an intermediary substance to join the green ceramic sub-components. This braze material facilitates bonding at lower temperatures and pressures compared to traditional sintering methods, reducing manufacturing complexity while maintaining mechanical integrity and hermeticity of the final assembly.
2Reliability
If hot pressing and sintering are used to join ceramic pieces, then hermetic seal is achieved, but manufacturing time and energy consumption increase
Solution Approach 1:
The joining process parameters are changed from high-temperature sintering to lower-temperature brazing. The braze filler material enables hermetic sealing at reduced temperatures and shorter processing times, significantly decreasing manufacturing time and energy consumption while maintaining the hermetic seal requirement.
3Strength
If high compressive force is applied during sintering to join shaft to plate, then structural integrity is achieved, but shaft wall thickness must be increased, adding weight and complexity
Solution Approach 1:
The braze filler material acts as an intermediary that distributes and absorbs the bonding forces between the shaft and plate, eliminating the need for high compressive forces during joining. This allows the shaft walls to be thinner than required for traditional sintering methods, reducing weight and complexity while maintaining structural integrity.
4Strength
If ceramic components are manufactured as single large pieces, then mechanical strength is achieved, but repair and reuse become impossible, leading to scrap
Solution Approach 1:
The ceramic component is segmented into multiple joinable sub-components (shaft, plate, and other elements) that can be assembled and disassembled. The brazed joints provide sufficient mechanical strength for normal operation while allowing components to be separated for repair or reuse, eliminating the scrap issue associated with monolithic ceramic pieces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and complexity by eliminating the need for high-temperature sintering, enables the use of lower contact pressures, and allows for the repair and reuse of expensive components, maintaining mechanical integrity and hermeticity under severe operating conditions.
Implementation Method 1
A brazing method is used to join ceramic pieces, employing a metal binder like aluminum, which forms a hermetic seal at lower temperatures and pressures
Data Source
AI summary
A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.