Brazing Structure for Hermetic Sealing in Miniaturized Electronic Packages
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Solution Overview
Problem
Smaller electronic component housing packages face reliability issues with hermetical sealing due to narrower frame bodies and reduced joint areas between the metal frame and the insulating substrate, leading to potential external environment infiltration.
Innovation Solution
The implementation of a brazing structure with a first sloping portion on the frame-shaped metallized layer and a fillet portion between the metallized layer and the metal frame, along with a filling portion, enhances the hermetical sealing by increasing the joint area and ensuring a firmer connection across the outer and lower surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to meet miniaturization requirements, then the package dimensions are improved, but the hermetical sealing reliability deteriorates due to narrower frame bodies and reduced joint areas
Solution Approach 1:
The patent introduces a sloping portion that extends from the upper surface to the lower surface of the insulating substrate, creating a three-dimensional brazing structure. This dimensional transition allows the brazing material to form a fillet portion that increases the effective joint area without increasing the planar footprint of the package, thus maintaining miniaturization while improving sealing reliability.
Solution Approach 2:
The patent employs a composite brazing structure consisting of multiple materials: the frame-shaped metallized layer, the brazing material, and the insulating substrate. The metallized layer provides a bonding interface, the brazing material forms the sealing joint, and the sloping portion geometry optimizes the distribution of stresses. This composite approach enhances the hermetical sealing by creating a multi-material joint system with improved mechanical and sealing properties.
2Area of moving object
If the frame body width is reduced for smaller packages, then the package footprint is improved, but the joint area between metal frame and insulating substrate is reduced, worsening the hermetical sealing
Solution Approach 1:
The patent utilizes the vertical dimension by creating a sloping portion that extends from the upper surface to the lower surface of the insulating substrate. This allows the brazing material to form a fillet portion that increases the joint area in the vertical direction, compensating for the reduced horizontal joint area caused by the narrower frame body, thus maintaining effective sealing without increasing package footprint.
Solution Approach 2:
The patent changes the geometric parameters of the brazing joint by introducing a sloping portion with a specific angle and depth. This parameter modification increases the surface area available for brazing material adhesion and improves the mechanical interlocking between the metal frame and insulating substrate, thereby enhancing hermetical sealing despite the reduced frame body width.
3Ease of manufacture
If a simple brazing structure is used for ease of manufacture, then the manufacturing process is simplified, but the hermetical sealing reliability is insufficient for smaller packages
Solution Approach 1:
The patent incorporates a frame-shaped metallized layer on the insulating substrate before the brazing process. This preliminary metallization creates a ready-to-brazing surface that simplifies the subsequent brazing operation while ensuring reliable metallurgical bonding. The metallized layer serves as a pre-prepared bonding interface that enhances hermetical sealing without significantly complicating the manufacturing process.
Solution Approach 2:
The patent optimizes the geometric parameters of the brazing joint, specifically introducing a sloping portion with controlled dimensions. This parameter optimization ensures that the brazing material forms an appropriate fillet portion that achieves reliable hermetical sealing. The sloping geometry is designed to facilitate proper brazing material flow and distribution, maintaining ease of manufacture while improving sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the hermetical sealing of electronic component housing packages by expanding the joint area between the metal frame and the frame-shaped metallized layer, effectively preventing external environment infiltration and ensuring reliable sealing for smaller packages.
Implementation Method 1
a metal frame joined to the frame-shaped metallized layer with a brazing material
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3
AI summary
An electronic component housing package includes an insulating substrate (101) having an upper surface including a mount (102) for an electronic component (103), a frame-shaped metallized layer (106) surrounding the mount (102) on the upper surface of the insulating substrate (101), and a metal frame (108) joined to the frame-shaped metallized layer (106) with a brazing material (107). The frame-shaped metallized layer (106) includes a first sloping portion (109) sloping inwardly from an upper surface to an inner peripheral surface. The brazing material (107) includes a fillet portion (107a) formed between an upper outer periphery of the frame-shaped metallized layer (106) and the metal frame (108), and a filling portion (107b) formed between the first sloping portion (109) and the metal frame (108).