Solid-State Circuit Breaker Power Module With Dielectric Heat Sink
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Solution Overview
Problem
Existing power modules for solid-state circuit breakers face challenges in maximizing heat dissipation, achieving design symmetry, and ensuring optimal driving conditions for power electronics switches, while also being limited by etching technologies in creating fine electrically conductive patterns.
Innovation Solution
The power module incorporates a dielectric potting material with a bi-directional power electronics switch and non-power electronics circuits, featuring a dielectric material heat sink with a copper or silver electrically conductive power pattern applied using additive deposition. This design includes auxiliary dielectric substrates for axially symmetrical arrangements and minimizes inductance in the commutation loop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching method is used to create electrically conductive patterns on ceramic substrate, then material fixation is achieved, but manufacturing precision and fine pattern creation are limited
Solution Approach 1:
The patent replaces the mechanical etching process with a printing process for creating electrically conductive patterns. Specifically, copper powder is suspended in a binder to form a paste that is printed onto the ceramic substrate, eliminating the need for complex etching machinery and chemical processes while achieving finer pattern resolution.
Solution Approach 2:
The patent changes the physical state and form of the conductive material from solid copper layers requiring etching to copper powder suspended in binder for printing. This parameter change enables direct deposition of fine patterns without material removal, improving manufacturing precision while simplifying the manufacturing process.
2Loss of energy
If transistors are arranged in parallel to achieve high nominal currents, then thermal loss is reduced, but device complexity and control difficulty increase
Solution Approach 1:
The patent merges multiple transistors into a single integrated power electronics circuit module where parallel transistors are controlled by a unified control mechanism. The control circuit is integrated with the power transistors on the same ceramic substrate, simplifying the control of parallel devices while maintaining the thermal benefits of parallel configuration.
Solution Approach 2:
The patent creates a universal power module design where the same ceramic substrate and control circuit architecture can handle multiple parallel transistors configured for high current applications. The modular design allows the same structure to be scaled for different current requirements without increasing control complexity.
3Strength
If copper layer is made thicker than semiconductor bare die, then mechanical support is provided, but fine electrically conductive patterns cannot be achieved
Solution Approach 1:
The patent uses a composite material system consisting of copper powder mixed with a binder to create the electrically conductive pattern. This composite allows the formation of thin, fine patterns that still provide adequate mechanical support and electrical conductivity, overcoming the limitation of thick solid copper layers.
Solution Approach 2:
The patent applies different material properties to different regions: the copper powder-binder composite is applied only where fine conductive patterns are needed, while the overall ceramic substrate provides the mechanical support. This local differentiation allows thin conductive patterns without compromising structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, achieves excellent design symmetry, and ensures optimal driving conditions for power electronics switches, while allowing for the creation of detailed electrically conductive patterns without etching, thus reducing current density and thermal resistance.
Implementation Method 1
a heat sink made of a dielectric material having thermal conductivity over 20 W/m/K
Implementation Method 2
an electrically conductive power pattern made of copper, silver or a combination thereof, applied directly on the heat sink by additive deposition
Data Source
Figure 1~2
Figure 3~4
AI summary
A power module for a solid-state circuit breaker includes a heat sink (1) made of a dielectric material having thermal conductivity over 20 W/m/K provided on its surface with an electrically conductive power pattern (3). A bi-directional power electronics switch (5) is placed on the electrically conductive power pattern (3) and connected by an electrically conductive power connection (2). The electrically conductive power pattern (3) is interconnected with auxiliary dielectric substrates (9) on which electrically conductive non-power patterns (18) interconnecting non-power electronics circuits (7) are placed. At least the heat sink (1), the-power electronics switch (5), the auxiliary dielectric substrates (9), and the non-power electronics circuits (7) are jointly included in a monolithic multilayer structure elements of which are connected through entire contact surfaces. The heat sink (1) may be mechanically and thermally connected with an auxiliary heat sink (14) made of electrically conductive material having thermal conductivity over 180 W/m/K. Connection is made of a contact layer (20) compensating different coefficients of thermal expansion of the heat sink (1) and of the auxiliary heat sink (14).