Low-Voltage Circuit Breaker Semiconductor Arrangement
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Solution Overview
Problem
Existing low-voltage protective switching devices with IGBT power modules face high stress and limited service life due to high loads on bypass switches and semiconductor components during short-circuit current switching, leading to unequal conditions and longer commutation times for different polarities.
Innovation Solution
The arrangement of semiconductor components on opposite sides of a component carrier reduces current paths and loop inductance, enabling faster commutation times and identical conditions for both polarities, thus reducing component load and enabling smaller device dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor components are arranged on one side on a carrier in conventional IGBT power modules, then the structure is simple to manufacture, but the line paths and loops become long, increasing commutation time and causing different line lengths for different polarities
Solution Approach 1:
The patent transitions from a planar arrangement where all components are on one side to a three-dimensional arrangement using opposite sides of the carrier. The first semiconductor component group is mounted on the first side and the second semiconductor component group is mounted on the second side, utilizing the vertical dimension to reduce current path lengths and loop inductance while maintaining manufacturing feasibility.
Solution Approach 2:
The patent divides the semiconductor components into two separate groups arranged on opposite sides of the carrier. This segmentation allows independent optimization of each group's positioning and reduces the overall current loop length by separating the return paths, thereby reducing commutation time without complicating the manufacturing process.
2Volume of moving object
If semiconductor components are arranged on one side on a carrier, then the device structure is compact, but different line lengths for different polarities lead to unequal conditions and compensating currents
Solution Approach 1:
The patent intentionally creates a symmetrical arrangement across the carrier by placing identical semiconductor component groups on opposite sides. This symmetry ensures that current paths for different polarities have equal lengths and equivalent electrical characteristics, eliminating compensating currents and ensuring reliable operation for both polarities while maintaining a compact device structure.
3Power
If bypass switch contacts are subjected to high loads during short-circuit current switching, then the breaking capacity is achieved, but the service life and number of possible switching cycles are limited
Solution Approach 1:
The patent introduces a semiconductor circuit arrangement as an intermediary between the bypass switch and the load. The semiconductor components (IGBTs and diodes) handle the high-stress short-circuit current commutation, acting as a mediator that protects the bypass switch contacts from direct exposure to extreme electrical stresses, thereby extending the service life of the mechanical switch while maintaining the required breaking capacity.
Data Source
Figure 1~3
AI summary
The invention relates to a low-voltage circuit breaker device (1) comprising at least one outer conductor path (2) and one neutral conductor path (5), a mechanical bypass switch (8) being arranged in said outer conductor path (2), a semiconductor circuit arrangement (11) being connected in parallel to the bypass switch (8), a current measuring arrangement (12) being arranged in the outer conductor path (2) and connected to an electronic control unit (13) of said circuit breaker device (1), and the electronic control unit (13) being designed to actuate the bypass switch (8) and the first semiconductor circuit arrangement (11) upon detection of a predefined overload current by the current measuring arrangement (12), said semiconductor circuit arrangement (11) comprising at least one first semiconductor component assembly (65) and one second semiconductor component assembly (66), the first semiconductor component assembly (65) being positioned on a first side (61) of a component carrier (60), and the second semiconductor component assembly (66) being positioned on a second side (62) of the component carrier (60), where the second side faces away from the first side (61).