Breathable Storage Enclosure for PCB Memory Chip Cooling
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Solution Overview
Problem
As computing systems generate increasing amounts of data, existing data storage infrastructure faces challenges in efficiently managing heat dissipation within limited spaces, leading to potential performance degradation and increased costs due to the use of thermal pads which add weight, thickness, and manufacturing costs.
Innovation Solution
A breathable case design for storage devices comprising a first layer with larger pores and a second layer with smaller pores, made of materials like poly-urethane or graphene, which creates an air gap between semiconductor chips and the case, allowing for air flow to cool the chips and dissipate heat without direct contact, reducing the need for thermal pads and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal pads are used for heat dissipation, then heat dissipation performance is improved, but device weight, thickness, and manufacturing cost increase
Solution Approach 1:
The patent removes thermal pads from the heat dissipation system and replaces them with a breathable case structure that enables direct air flow cooling. The case includes air inlet holes and air flow paths that allow ambient air to directly cool the semiconductor chip, eliminating the need for thermal pad materials and reducing device weight.
Solution Approach 2:
The patent employs pneumatic cooling by designing air inlet holes and air flow paths in the breathable case. Ambient air flows through the case and directly contacts the semiconductor chip surface, using fluid dynamics to transfer heat away from the chip without requiring thermal conduction materials like thermal pads.
2Temperature
If thermal pads are used for heat dissipation, then heat dissipation performance is improved, but device thickness increases
Solution Approach 1:
The patent eliminates thermal pads that add thickness to the device structure. Instead, the breathable case design incorporates air flow channels and inlet holes that enable cooling within the existing device thickness envelope, removing the need for additional thick thermal management layers.
Solution Approach 2:
The breathable case functions as a thin protective shell that integrates cooling functionality. The case includes air inlet holes and flow paths but maintains a thin profile, providing both mechanical protection and thermal management without significantly increasing device thickness.
3Temperature
If thermal pads are used for heat dissipation, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes thermal pads from the bill of materials, eliminating their associated costs. The breathable case structure with air inlet holes and flow paths uses simpler, more cost-effective materials and manufacturing processes compared to specialized thermal pad materials.
Solution Approach 2:
The breathable case incorporates porous or perforated structures with air inlet holes that enable passive air flow cooling. This approach uses simple geometric features rather than expensive functional materials, reducing manufacturing cost while maintaining effective heat dissipation.
4Quantity of substance
If multiple storage devices are integrated in limited space, then storage capacity is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent designs each storage device with an independent breathable case that has its own air inlet holes and cooling paths. This segmentation allows each device to cool itself independently, preventing heat accumulation when multiple devices are densely packed together, thus maintaining heat dissipation effectiveness at high storage capacities.
Solution Approach 2:
Each storage device's breathable case provides self-cooling through integrated air flow paths and inlet holes. The devices do not require external cooling infrastructure or shared thermal management systems, allowing dense integration while each unit autonomously manages its own heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains semiconductor chip surface temperatures below 70°C, reduces device size and weight, and lowers manufacturing costs by utilizing air flow for heat dissipation, while providing protection against impacts and moisture.
Implementation Method 1
allowing for air flow to cool the chips and dissipate heat
Implementation Method 2
enhancing thermal conductivity
Implementation Method 3
providing protection against impacts and moisture
Data Source
AI summary
A storage device includes a printed circuit board (PCB) with attached semiconductor chips, each including a memory, and with at least one wire coupling the plural semiconductor chips, and a breathable case surrounding a top portion and a bottom portion of the printed circuit board. The breathable case includes a first layer disposed on a second layer which is exposed to the printed circuit board. The second layer has smaller pores than the first layer.